US 9,811,211 B2
Position sensor
Yusuke Shimizu, Ibaraki (JP); and Ryoma Yoshioka, Ibaraki (JP)
Appl. No. 14/768,060
Filed by NITTO DENKO CORPORATION, Ibaraki-shi, Osaka (JP)
PCT Filed Jan. 14, 2014, PCT No. PCT/JP2014/050400
§ 371(c)(1), (2) Date Aug. 14, 2015,
PCT Pub. No. WO2014/136471, PCT Pub. Date Sep. 12, 2014.
Claims priority of application No. 2013-044071 (JP), filed on Mar. 6, 2013; and application No. 2013-087939 (JP), filed on Apr. 19, 2013.
Prior Publication US 2015/0378517 A1, Dec. 31, 2015
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 3/042 (2006.01); G06F 3/041 (2006.01); G02B 6/43 (2006.01); G06F 1/16 (2006.01)
CPC G06F 3/0428 (2013.01) [G02B 6/43 (2013.01); G06F 1/16 (2013.01); G06F 3/0418 (2013.01); G06F 3/0421 (2013.01); G06F 2203/04109 (2013.01)] 3 Claims
OG exemplary drawing
1. A position sensor in a sheet form comprising:
an optical waveguide in a sheet form including an under cladding layer in a sheet form, a plurality of linear cores arranged in a lattice form and formed on a surface of the under cladding layer, and an over cladding layer in a sheet form formed to cover the cores;
a light-emitting element connected to one end surface of the cores; and
a light-receiving element connected to the other end surface of the cores,
wherein a pressed position is specified, based on a change in the amount of light propagating in the cores, when a surface of the position sensor is pressed at any position,
wherein the cores have an elasticity modulus of 2 GPa to 5 GPa,
wherein the under cladding layer has an elasticity modulus of 1 MPa to 100 MPa,
wherein the over cladding layer has an elasticity modulus of 1 MPa to less than 5 GPa, and
wherein the deformation rate of a cross section of the cores as seen in a pressed direction is lower than the deformation rates of cross sections of the over cladding layer and the under cladding layer when a surface of the optical waveguide in the sheet form is pressed.