US 9,811,127 B2
Twin server blades for high-density clustered computer system
Steven J. Dean, Chippewa Falls, WI (US); Roger Ramseier, Chippewa Falls, WI (US); Mark Maloney, Chippewa Falls, WI (US); and David R. Collins, Eau Claire, WI (US)
Assigned to Hewlett Packard Enterprise Development LP, Houston, TX (US)
Filed by Silicon Graphics International Corp., Fremont, CA (US)
Filed on Jun. 28, 2013, as Appl. No. 13/931,748.
Claims priority of provisional application 61/724,274, filed on Nov. 8, 2012.
Prior Publication US 2014/0126142 A1, May 8, 2014
Int. Cl. H05K 5/00 (2006.01); H05K 7/00 (2006.01); G06F 1/20 (2006.01); H05K 7/20 (2006.01); G06F 1/18 (2006.01)
CPC G06F 1/20 (2013.01) [G06F 1/181 (2013.01); H05K 7/20754 (2013.01); H05K 7/20827 (2013.01); G06F 2200/201 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A high performance computing (HPC) system having a plurality of computing blades, at least one computing blade comprising:
two computing boards; and
two side rails disposed at either side of the computing boards, each side rail having a board alignment element configured to hold the two computing boards within the computing blade; wherein the board alignment element includes a substantially c-shaped portion with upper and lower board attachment portions substantially perpendicular to the side rails and also includes mounting sections that extend beyond an outer side of each of the board attachment portions respectively, wherein the mounting sections are configured to couple the board alignment element to the side rail in a snap-fit configuration, and wherein each computing board is adjacent to the outer side of the upper or lower board attachment portions.