US 9,811,077 B2
Polishing with pre deposition spectrum
Tomohiko Kitajima, San Jose, CA (US); Jeffrey Drue David, San Jose, CA (US); Jun Qian, Sunnyvale, CA (US); Taketo Sekine, Cupertino, CA (US); Garlen C. Leung, San Jose, CA (US); and Sidney P. Huey, Fremont, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jul. 16, 2014, as Appl. No. 14/333,395.
Prior Publication US 2016/0018815 A1, Jan. 21, 2016
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 19/00 (2011.01); G05B 19/418 (2006.01)
CPC G05B 19/418 (2013.01) [G05B 2219/45031 (2013.01); G05B 2219/45232 (2013.01); Y02P 90/02 (2015.11)] 19 Claims
OG exemplary drawing
 
1. A computer program product, encoded on one or more non-transitory computer storage media, comprising instructions that when executed by one or more computers cause the one or more computers to perform operations comprising:
storing a base spectrum, the base spectrum being a spectrum of light reflected from a substrate after deposition of a plurality of deposited dielectric layers overlying a metallic layer or semiconductor wafer and before deposition of a non-metallic layer over the plurality of deposited dielectric layers;
after deposition of the non-metallic layer over the plurality of deposited dielectric layers and during polishing of the non-metallic layer on the substrate, receiving from an in-situ optical monitoring system measurements of a sequence of raw spectra of light reflected from the substrate during polishing;
normalizing each raw spectrum in the sequence of raw spectra to generate a sequence of normalized spectra using the raw spectrum and the base spectrum; and
determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra.