US 9,811,004 B2
Exposure apparatus and device fabrication method
Shinichi Hirano, Utsunomiya (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Jul. 5, 2013, as Appl. No. 13/935,595.
Application 13/935,595 is a continuation of application No. 12/832,671, filed on Jul. 8, 2010, granted, now 8,502,959.
Claims priority of application No. 2009-163007 (JP), filed on Jul. 9, 2009; and application No. 2010-139950 (JP), filed on Jun. 18, 2010.
Prior Publication US 2013/0293864 A1, Nov. 7, 2013
This patent is subject to a terminal disclaimer.
Int. Cl. G03B 27/58 (2006.01); G03B 27/52 (2006.01); G03B 27/60 (2006.01); G03B 27/32 (2006.01); G03F 7/20 (2006.01); G03B 27/42 (2006.01)
CPC G03F 7/70733 (2013.01) [G03F 7/7075 (2013.01); G03F 7/70691 (2013.01); G03F 7/70725 (2013.01); G03F 7/70783 (2013.01)] 21 Claims
OG exemplary drawing
 
8. A device fabrication method comprising the steps of:
applying a photoresist on a substrate;
conveying the substrate using a convey method; and
exposing the substrate,
wherein the convey method comprises the steps of:
holding the substrate by chucking a lower surface of the substrate to a convey unit;
moving the convey unit to convey the substrate, while the substrate is chucked to the convey unit, in a downward direction; and
moving the convey unit to convey the substrate, while the substrate is chucked to the convey unit, in an upward direction,
wherein a maximum of an absolute value of acceleration of the convey unit during the conveying of the substrate in the downward direction is smaller than a maximum of an absolute value of acceleration of the convey unit during conveying of the substrate in the upward direction.