US 9,811,000 B2
Photolithography tool and method thereof
Chia-Feng Liao, Taichung (TW); Chun-Hsien Lin, Hsinchu (TW); Pei-Yi Su, Taichung (TW); Yi-Ming Dai, Hsinchu (TW); Chung-Hsing Lee, Hsinchu County (TW); Chien-Ko Liao, Taichung (TW); Chun-Yung Chang, Hsinchu (TW); Nan-Jung Chen, Hsinchu (TW); Pei-Yuan Wu, Hsinchu (TW); and Hsien-Mao Huang, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Oct. 30, 2015, as Appl. No. 14/929,098.
Prior Publication US 2017/0123328 A1, May 4, 2017
Int. Cl. G03B 27/42 (2006.01); G03F 7/20 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01)
CPC G03F 7/70483 (2013.01) [G01N 21/8851 (2013.01); G01N 21/9501 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A photolithography tool, comprising:
at least one process chamber;
at least one front opening unified pod (FOUP) stage;
at least one moving mechanism configured to move at least one wafer from the process chamber to the FOUP stage;
an image sensor configured to capture an image of the wafer on the moving mechanism;
a detector configured to detect whether the wafer is present within a field of view of the image sensor; and
an actuator configured to actuate the image sensor to capture the image of the wafer when the wafer is detected to be present within the field of view of the image sensor.