US 9,810,984 B2
Photosensitive transfer material, pattern formation method, and etching method
Hideaki Ito, Fujinomiya (JP); Shinji Fujimoto, Fujinomiya (JP); and Yasumasa Kawabe, Fujinomiya (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Apr. 15, 2015, as Appl. No. 14/687,491.
Application 14/687,491 is a continuation of application No. PCT/JP2013/078404, filed on Oct. 21, 2013.
Claims priority of application No. 2012-237163 (JP), filed on Oct. 26, 2012.
Prior Publication US 2015/0219993 A1, Aug. 6, 2015
Int. Cl. G03F 7/039 (2006.01); G03F 7/30 (2006.01); G03F 7/40 (2006.01); G03F 7/09 (2006.01); G03F 7/16 (2006.01); C08F 12/22 (2006.01); G03F 7/11 (2006.01); C08F 12/24 (2006.01)
CPC G03F 7/094 (2013.01) [C08F 12/22 (2013.01); C08F 12/24 (2013.01); G03F 7/039 (2013.01); G03F 7/0392 (2013.01); G03F 7/0397 (2013.01); G03F 7/11 (2013.01); G03F 7/161 (2013.01); G03F 7/30 (2013.01); G03F 7/40 (2013.01); Y02P 20/582 (2015.11)] 14 Claims
 
1. A photosensitive transfer material comprising:
a support;
a thermoplastic resin layer; and
a photosensitive resin composition layer in this order,
wherein:
the photosensitive resin composition layer includes a polymer component (A) consisting of an acrylic resin, and a photoacid generator (B);
the acrylic resin includes a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group,
the photosensitive resin composition layer consists of one layer; and
the constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group is represented by Formula (A2′):

OG Complex Work Unit Drawing
in Formula (A2′), each of R31 and R32 independently represents a hydrogen atom, an alkyl group, or an aryl group, either or both R31 and R32 is an alkyl group or an aryl group, R33 represents an alkyl group or an aryl group, R31 or R32, and R33 may be combined together so as to form a cyclic ether, R34 represents a hydrogen atom or a methyl group, and X0 represents a single bond.
 
11. A pattern forming method comprising:
forming a photosensitive resin composition layer on at least one surface of a substrate using the photosensitive transfer material according to claim 1;
exposing the photosensitive resin composition layer; and
developing the exposed photosensitive resin composition layer.
 
13. An etching method comprising:
etching using the pattern formed by the pattern forming method according to claim 11 as an etching resist; and
removing the pattern through a chemical treatment after etching.