US 9,810,981 B2
Pattern formation method, etching method, electronic device manufacturing method, and electronic device
Ryosuke Ueba, Haibara-gun (JP); Naoya Iguchi, Haibara-gun (JP); Tsukasa Yamanaka, Haibara-gun (JP); Naohiro Tango, Haibara-gun (JP); Michihiro Shirakawa, Haibara-gun (JP); and Keita Kato, Haibara-gun (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Aug. 5, 2016, as Appl. No. 15/229,247.
Application 15/229,247 is a continuation of application No. PCT/JP2015/053058, filed on Feb. 4, 2015.
Claims priority of application No. 2014-027793 (JP), filed on Feb. 17, 2014; and application No. 2014-257489 (JP), filed on Dec. 19, 2014.
Prior Publication US 2016/0342083 A1, Nov. 24, 2016
Int. Cl. G03F 7/20 (2006.01); G03F 7/00 (2006.01); G03F 7/32 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); G03F 7/40 (2006.01)
CPC G03F 7/0035 (2013.01) [G03F 7/2053 (2013.01); G03F 7/325 (2013.01); G03F 7/40 (2013.01); H01L 21/0271 (2013.01); H01L 21/31144 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A pattern formation method comprising:
step (i) of forming a first negative type pattern on a substrate by performing step (i-1) below, step (i-2) below and step (i-3) below in this order;
step (i-1) of forming a first film on the substrate using an actinic ray-sensitive or radiation-sensitive resin composition (1) which contains a resin of which, due to a polarity being increased by an action of an acid, a solubility decreases with respect to a developer which includes an organic solvent;
step (i-2) of exposing the first film;
step (i-3) of developing the exposed first film using the developer which includes an organic solvent to form the first negative type pattern,
wherein the first negative type pattern contains hole patterns;
step (ii) of heating the first negative type pattern;
step (iii) of forming a second film at least on the first negative type pattern using an actinic ray-sensitive or radiation-sensitive resin composition (2) which contains a resin of which, due to a polarity being increased by an action of an acid, a solubility decreases with respect to the developer which includes an organic solvent;
step (v) of exposing the second film; and
step (vi) of developing the exposed second film using the developer which includes an organic solvent to form a second negative type pattern at least on the first negative type pattern,
wherein the second negative type pattern contains line and space patterns, and the space portions of the second negative type pattern are placed on the hole portions of the first negative type pattern, and the line portions of the second negative type pattern are placed so as not to cover the hole portions of the first negative type pattern; and
wherein the step (ii) is carried out between the step (i-3) and the step (iii).