US 9,810,953 B2
LCD panel and method for manufacturing the same
Jo Shan Wu, Guangdong (CN); and Kuancheng Lee, Guangdong (CN)
Assigned to Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong (CN)
Appl. No. 13/636,651
Filed by Jo Shan Wu, Guangdong (CN); and Kuancheng Lee, Guangdong (CN)
PCT Filed Jun. 21, 2012, PCT No. PCT/CN2012/077308
§ 371(c)(1), (2), (4) Date Sep. 21, 2012,
PCT Pub. No. WO2013/185373, PCT Pub. Date Dec. 19, 2013.
Claims priority of application No. 2012 1 00199235 (CN), filed on Jun. 15, 2012.
Prior Publication US 2013/0335691 A1, Dec. 19, 2013
Int. Cl. G02F 1/1339 (2006.01)
CPC G02F 1/13394 (2013.01) [G02F 1/1339 (2013.01); G02F 1/13392 (2013.01); G02F 2001/13398 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A liquid crystal display (LCD) panel, comprising:
an array substrate;
a color filter (CF) substrate disposed opposite to the array substrate; and
a spacer disposed between the array substrate and the CF substrate, the spacer comprising a columnar platform and a recessed platform having a recess portion and a peripheral portion surrounding the recess portion, the columnar platform and the recessed platform engaging each other, wherein the columnar platfatin is inserted into the recess portion of the recessed platform and fits the recess portion, wherein the columnar platform has a surface contacting a surface of the recess portion of the recessed platform and the two surfaces are flat surfaces, and wherein the recessed platform is constructed by a passivation layer, a metal layer, and a semiconductor layer stacked one above another;
the columnar platform disposed on one side of the CF substrate, the recessed platform disposed on one side of the array substrate;
the recessed platform located on a gate line or a data line of the array substrate,
wherein the passivation layer of the recessed platform contacts the semiconductor layer in an area corresponding to the surface of the recess portion of the recessed platform, and the metal layer is formed between the passivation layer and the semiconductor layer to surround the surface of the recess portion of the recessed platform.