US 9,810,796 B2
Method for producing a sensor board for a detector module
Miguel Labayen De Inza, Forchheim (DE); and Jan Wrege, Erlangen (DE)
Assigned to Siemens Aktiengesellschaft, Munich (DE)
Filed by Siemens Aktiengesellschaft, München (DE)
Filed on Oct. 15, 2015, as Appl. No. 14/883,751.
Claims priority of application No. 10 2014 221 829 (DE), filed on Oct. 27, 2014.
Prior Publication US 2016/0116610 A1, Apr. 28, 2016
Int. Cl. G01T 1/24 (2006.01)
CPC G01T 1/243 (2013.01) 18 Claims
OG exemplary drawing
1. A method for producing a hybrid, incorporable into a sensor board, for a detector module including a plurality of reader units, the method comprising:
positioning the plurality of reader units in a stacked construction, each of the plurality of reader units being in direct contact with a common sensor layer; and
fastening, after all of the plurality of reader units are positioned, the plurality of reader units together directly to the common sensor layer using soldering elements, to thereby form the hybrid.