US 9,810,715 B2
High impedance compliant probe tip
Julie A. Campbell, Beaverton, OR (US); Ira G. Pollock, Hillsboro, OR (US); William A. Hagerup, Portland, OR (US); and Christina D. Enns, Beaverton, OR (US)
Assigned to Tektronix, Inc., Beaverton, OR (US)
Filed by Tektronix, Inc., Beaverton, OR (US)
Filed on Dec. 31, 2014, as Appl. No. 14/587,703.
Prior Publication US 2016/0187382 A1, Jun. 30, 2016
Int. Cl. G01R 1/067 (2006.01); H01R 13/24 (2006.01); H03F 1/00 (2006.01); H01L 21/00 (2006.01); G05G 1/00 (2006.01); G01R 1/073 (2006.01); H01R 101/00 (2006.01)
CPC G01R 1/06772 (2013.01) [G01R 1/06722 (2013.01); G01R 1/06766 (2013.01); H01R 13/2421 (2013.01); G01R 1/073 (2013.01); G05G 1/00 (2013.01); H01L 21/00 (2013.01); H01R 2101/00 (2013.01); H01R 2201/20 (2013.01); H03F 1/00 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A test probe tip, comprising:
a force deflecting assembly;
a resistive/impedance element configured to be coupled with the force deflecting assembly, wherein the resistive/impedance element is a round rod resistor that includes a resistive coating covering a tube; and
a tip component configured to be coupled with the resistive/impedance element, wherein the resistive/impedance element is configured to be coupled with the force deflecting assembly and the tip component via electro-mechanical bonds such that the resistive/impedance element forms a structural component of the test probe tip without an insulating covering applied thereto.