US 9,810,714 B2
Probe pin and method for producing a probe pin
Per Soerensen, Langenselbold (DE); Nicole Staudt, Friedberg (DE); Reinhold Weiland, Hanau (DE); Ingo Prunzel, Bruchköbel (DE); and David Francis Lupton, Gelnhausen (DE)
Assigned to Heraeus Deutschland GmbH & Co. KG, Hanau (DE)
Appl. No. 15/34,918
Filed by Heraeus Deutschland GmbH & Co. KG, Hanau (DE)
PCT Filed Nov. 7, 2013, PCT No. PCT/EP2013/073267
§ 371(c)(1), (2) Date May 6, 2016,
PCT Pub. No. WO2015/067312, PCT Pub. Date May 14, 2015.
Prior Publication US 2016/0252547 A1, Sep. 1, 2016
Int. Cl. G01R 1/067 (2006.01); G01R 3/00 (2006.01); H01R 43/20 (2006.01)
CPC G01R 1/06755 (2013.01) [G01R 1/06788 (2013.01); G01R 3/00 (2013.01); H01R 43/20 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A probe pin for electronic testing of semi-conductor elements, comprising an electrically conductive core element comprising a metallic alloy, and an electrically insulating jacket element, wherein the electrically insulating jacket element surrounds the electrically conductive core element over regions thereof, wherein the electrically conductive core element comprises a distal contact section for electrical contact with a semi-conductor element, and wherein the metallic alloy of the electrically conductive core element comprises at least 67% by weight rhodium; 0.1% by weight to 1% by weight zirconium; up to 1% by weight yttrium; and up to 1% by weight cerium.