US 9,810,662 B1
Structure for integrating microfluidic devices and electrical biosensors
Chao-Ching Yu, Taoyuan (TW); Lin-Ta Chung, Hsinchu County (TW); Hsi-Ying Yuan, Hsinchu County (TW); and Ke-Pan Liao, Hsinchu County (TW)
Assigned to CHIP WIN TECHNOLOGY CO., LTD., Hsinchu (TW); and Chao-Ching Yu, Taoyuan (TW)
Filed by CHIP WIN TECHNOLOGY CO., LTD., Hsinchu County (TW); and Chao-Ching Yu, Taoyuan (TW)
Filed on Jan. 16, 2017, as Appl. No. 15/406,809.
Claims priority of application No. 105126570 A (TW), filed on Aug. 19, 2016.
Int. Cl. G01N 27/414 (2006.01); H01L 21/76 (2006.01); H01L 29/772 (2006.01); H01L 29/00 (2006.01); H01L 21/70 (2006.01); G01N 27/00 (2006.01)
CPC G01N 27/4145 (2013.01) [H01L 21/76 (2013.01); H01L 29/772 (2013.01); G01N 27/00 (2013.01); H01L 21/70 (2013.01); H01L 29/00 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A structure for integrating microfluidic devices and electrical biosensors, comprising:
a substrate, disposed with a plurality of first vias, wherein the plurality of first vias being filled with a conductive material, and a conductive pad being disposed at both ends of each of the plurality of first vias, the conductive pad being electrically connected to the conductive material inside the first vias;
a flow channel layer, disposed on top of the substrate and comprising at least a channel for at least a fluid to flow, and a plurality of second vias, wherein the plurality of second vias being filled with a conductive material, and the conductive material being electrically connected to the conductive pad of the substrates;
a cover member, disposed on top of the flow channel layer and having at least a fluid inlet and at least a fluid outlet for the inflow and outflow of the at least a fluid, wherein the at least a fluid inlet and the at least a fluid outlet being connected to the at least a channel of the flow channel layer; a window opening, wherein the window opening exposing the at least a fluid; and a plurality of third vias, wherein the plurality of third vias being filled with a conductive material and the conductive material being electrically connected to the conductive material inside the second vias of the flow channel layer; and
an electrical biosensor, disposed and engaged to the cover element by flip chip bumps; wherein the electrical biosensor having a biosensing layer, and the window opening of the cover element contacting the biosensing layer when the at least a fluid flowing passing the window opening; the bumps being implanted inside the conductive material filling the plurality of third vias of the cover element to achieve electrical connection;
wherein the at least a fluid flowing in from the at least a fluid inlet, through the at least a channel to the biosensing layer of the electrical biosensor thereon for sensing and out of the at least a fluid outlet.