US 9,810,646 B2
Edge treatment system and method for evaluating a material
Yakup Bayram, Falls Church, VA (US); Alexander C. Ruege, Fairfax, VA (US); and Eric K. Walton, Columbus, OH (US)
Assigned to PANERATECH, INC., Chantilly, VA (US)
Filed by PaneraTech, Inc., Chantilly, VA (US)
Filed on Apr. 24, 2015, as Appl. No. 14/695,532.
Claims priority of provisional application 61/984,360, filed on Apr. 25, 2014.
Prior Publication US 2015/0355109 A1, Dec. 10, 2015
Int. Cl. G01R 27/02 (2006.01); G01N 22/00 (2006.01)
CPC G01N 22/00 (2013.01) 19 Claims
OG exemplary drawing
 
1. A system for treating an edge of a material under test to reduce a propagation of a first electromagnetic wave impinging upon said edge of said material under test, comprising:
a first substrate having a first edge disposed in between said edge of said material under test and a propagation path of said first electromagnetic wave, wherein said first edge of said first substrate partly overlaps said material under test, such that a first area of said first substrate overlaps a first area of said material under test and a second area of said first substrate extends outwards from said first area of said first substrate overlapping said first area of said material under test and beyond a projected line of said edge of said material under test onto said first substrate, and wherein said first substrate is physically structured to reduce said propagation of said first electromagnetic wave by a sufficient extent so as to enable detection of a second electromagnetic wave of interest that may propagate through said material under test by mitigating an interference to said detection of said second electromagnetic wave caused by an interaction of said first electromagnetic wave and said edge of said material under test;
wherein said first substrate comprises a substantially conductive material to reduce said propagation of said first electromagnetic wave through said first substrate.