US 9,810,641 B2
Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
Deepak Sood, New Britain, PA (US); Zhijie Wang, Chalfont, PA (US); Thomas J. Colosimo, Jr., West Chester, PA (US); David A. Rauth, Riverton, NJ (US); and Shu-Guo Tang, Chalfont, PA (US)
Assigned to Kulicke & Soffa Industries, Inc., Fort Washington, PA (US)
Filed by Kulicke & Soffa Industries, Inc., Fort Washington, PA (US)
Filed on Aug. 27, 2014, as Appl. No. 14/469,830.
Claims priority of provisional application 61/873,288, filed on Sep. 3, 2013.
Prior Publication US 2015/0059957 A1, Mar. 5, 2015
Int. Cl. G01N 21/95 (2006.01); G01N 21/88 (2006.01); H01L 21/66 (2006.01); G06T 7/00 (2017.01); G01N 21/84 (2006.01); H01L 23/00 (2006.01)
CPC G01N 21/9501 (2013.01) [G01N 21/8422 (2013.01); G01N 21/8806 (2013.01); G06T 7/0006 (2013.01); H01L 22/12 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); G01N 2021/8812 (2013.01); G01N 2021/8829 (2013.01); G06T 2207/10152 (2013.01); G06T 2207/30148 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83908 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A thermo-compression bonding machine comprising:
a bond head assembly for performing a thermo-compression bonding process;
a dispenser for dispensing an adhesive material onto a first semiconductor device element;
a support structure for supporting the first semiconductor device element including the adhesive material, the thermocompression bonding machine being adapted to bond a second semiconductor device element to the first semiconductor device element, the second semiconductor device element including conductive pillars configured to be thermo-compressively bonded to conductive structures of the first semiconductor device element, the adhesive material being configured to be provided between the first semiconductor device element and the second semiconductor device element;
a structured light source for providing a structured light pattern on the adhesive material;
a camera for creating an image of the structured light pattern on the adhesive material; and
image processing hardware and software for analyzing the image to determine a physical characteristic of the adhesive material, and to determine if the physical characteristic is within a predetermined specification.