US 9,810,586 B2
Temperature sensor and thermal, flow measuring device
Alexander Grun, Lorrach (DE); Hanno Schultheis, Lorrach (DE); and Tobias Baur, Reinach (CH)
Assigned to Endres + Hauser Flowtec AG, Reinach (CH)
Appl. No. 14/436,933
Filed by Endress + Hauser Flowtec AG, Reinach (CH)
PCT Filed Sep. 23, 2013, PCT No. PCT/EP2013/069680
§ 371(c)(1), (2) Date Apr. 20, 2015,
PCT Pub. No. WO2014/060186, PCT Pub. Date Apr. 24, 2014.
Claims priority of application No. 20 2012 104 039 U (DE), filed on Oct. 19, 2012; and application No. 20 2013 103 404 U (DE), filed on Jul. 29, 2013.
Prior Publication US 2015/0276503 A1, Oct. 1, 2015
Int. Cl. G01K 7/16 (2006.01); G01F 1/684 (2006.01); G01F 1/69 (2006.01); G01K 7/18 (2006.01); G01F 1/692 (2006.01); G01F 15/14 (2006.01); G01K 1/08 (2006.01); G01F 1/696 (2006.01); G01D 11/24 (2006.01)
CPC G01K 7/16 (2013.01) [G01F 1/684 (2013.01); G01F 1/69 (2013.01); G01F 1/692 (2013.01); G01F 1/696 (2013.01); G01F 15/14 (2013.01); G01K 1/08 (2013.01); G01K 7/18 (2013.01); G01D 11/245 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A temperature sensor, comprising:
a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers; and
a circuit board, wherein:
one of said temperature sensor elements is heatable;
from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board;
said circuit board is arranged in said housing chamber;
said circuit board is positioned in said housing chamber by a snap-in connection; and
a terminally located part of said housing is embodied as a deep draw cap with a wall thickness of less than 2 mm, preferably less than 1.5 mm, especially less than 0.8 mm.