US 9,810,582 B2
Temperature measuring board device and temperature measuring board thereof
Hao-Chun Hsieh, New Taipei (TW); Hsin-Lun Tsai, New Taipei (TW); and Kaun-Chang Wu, New Taipei (TW)
Assigned to Wistron Corporation, New Taipei (TW)
Filed by WISTRON CORPORATION, New Taipei (TW)
Filed on Oct. 8, 2014, as Appl. No. 14/509,565.
Claims priority of application No. 103116098 A (TW), filed on May 6, 2014.
Prior Publication US 2015/0323393 A1, Nov. 12, 2015
Int. Cl. G01K 1/16 (2006.01); G01K 1/14 (2006.01); G01K 13/00 (2006.01); G01K 7/02 (2006.01); G01K 1/20 (2006.01)
CPC G01K 1/14 (2013.01) [G01K 1/20 (2013.01); G01K 7/02 (2013.01); G01K 7/021 (2013.01); G01K 13/00 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A temperature measuring board for use in measuring an oven temperature of a reflow oven, said temperature measuring board comprising:
a modular substrate including a plurality of substrates assembled to each other, each of said substrates having at least one first fixing portion, and at least one second fixing portion removably fixed to said first fixing portion of another one of said substrates, wherein a selected number of said substrates can be assembled to each other to form a desired shape of said modular substrate through engagement of said first and second fixing portions; and
a thermal compensation unit including at least one surface-measured compensation member fixed to said modular substrate at a selected location.