US 9,810,456 B2
Heat pump apparatus
Naoki Sakamoto, Gunma (JP); and Yu Haraki, Osaka (JP)
Appl. No. 14/385,342
Filed by Panasonic Corporation, Kadoma-shi, Osaka (JP)
PCT Filed Jan. 23, 2014, PCT No. PCT/JP2014/000329
§ 371(c)(1), (2) Date Sep. 15, 2014,
PCT Pub. No. WO2014/115555, PCT Pub. Date Jul. 31, 2014.
Claims priority of application No. 2013-011323 (JP), filed on Jan. 24, 2013.
Prior Publication US 2015/0059383 A1, Mar. 5, 2015
Int. Cl. F25B 30/02 (2006.01); F25B 43/04 (2006.01); F25B 1/00 (2006.01); F25B 41/06 (2006.01)
CPC F25B 30/02 (2013.01) [F25B 1/00 (2013.01); F25B 41/06 (2013.01); F25B 41/067 (2013.01); F25B 43/04 (2013.01)] 16 Claims
OG exemplary drawing
1. A heat pump apparatus comprising:
an evaporator that evaporates a refrigerant;
an electrochemical compressor that compresses the refrigerant evaporated in the evaporator by use of an electrochemically active, non-condensable gas;
a condenser that condenses the refrigerant compressed by the electrochemical compressor;
a refrigerant delivery path for delivering the refrigerant from the condenser to the evaporator; and
a non-condensable gas return path provided separately from the refrigerant delivery path, the non-condensable gas return path being configured to communicate a discharge-side high-pressure space of the electrochemical compressor with a suction-side low-pressure space of the electrochemical compressor so as to return the non-condensable gas from the high-pressure space to the low-pressure space.