US 9,809,897 B2
Metal plating apparatus and method using solenoid coil
Hsili Chen, Tainan (TW); Kuan-Hsiao Lin, Daliao Township (TW); Chung-Yen Yang, Tainan (TW); and Shao-Chien Yang, Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed on Mar. 13, 2013, as Appl. No. 13/801,081.
Prior Publication US 2014/0262796 A1, Sep. 18, 2014
Int. Cl. C25D 7/12 (2006.01); C25D 17/00 (2006.01); C25D 17/10 (2006.01); C25D 5/00 (2006.01)
CPC C25D 17/001 (2013.01) [C25D 5/006 (2013.01); C25D 7/12 (2013.01); C25D 17/10 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A metal plating apparatus, comprising:
a chemical bath chamber;
an anode disposed at a bottom portion of the chemical bath chamber;
a cathode disposed at a top portion of the chemical bath chamber;
an anode chamber disposed within the chemical bath chamber, wherein the anode chamber has a side wall that surrounds the anode, an upper surface of the anode chamber contacting the side wall and being disposed between the anode and a metal block overlying the anode chamber and underlying the cathode, the side wall extending from the anode and ending at an upper surface of the anode chamber;
a solenoid coil, wherein the solenoid coil is disposed within the chemical bath chamber between the anode and the cathode, and wherein the solenoid coil is at least partially submerged in a liquid chemical bath, wherein a virtual line that is parallel to a major surface of the anode sequentially passes through a side wall of the chemical bath chamber, the liquid chemical bath, the solenoid coil, the liquid chemical bath, the anode, the liquid chemical bath, the solenoid coil, the liquid chemical bath, and the side wall of the chemical bath chamber; and
a coil frame that provides a waterproof enclosure of the solenoid coil within the chemical bath chamber, the liquid chemical bath extending along an inner side wall and an outer side wall of the coil frame;
wherein the solenoid coil is arranged to apply a magnetic field during a metal plating process in a direction from the anode to the cathode.