US 9,809,892 B1
Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
Yi Qin, Westborough, MA (US); Kristen Flajslik, Hopkinton, MA (US); and Mark Lefebvre, Hudson, NH (US)
Assigned to Rohm and Haas Electronic Materials LLC, Marlborough, MA (US)
Filed by Rohm and Haas Electronic Materials LLC, Marlborough, MA (US)
Filed on Jul. 18, 2016, as Appl. No. 15/212,737.
Int. Cl. C25D 3/00 (2006.01); C25D 3/54 (2006.01); C25D 21/04 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01)
CPC C25D 3/54 (2013.01) [C25D 5/022 (2013.01); C25D 7/123 (2013.01); C25D 21/04 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method comprising:
a) providing a substrate comprising a metal layer;
b) contacting the substrate with an indium electroplating composition comprising one or more sources of indium ions, one or more 1,10-phenanthroline compounds in amounts of 0.1 ppm to 15 ppm and citric acid, salt of citric acid or mixtures thereof; and
c) electroplating an indium metal layer on the metal layer of the substrate with the indium electroplating composition.