US 9,809,882 B2
Article and process for selective deposition
Owen Hildreth, Pacific Grove, CA (US)
Assigned to The United States of America, as represented by the Secretary of Commerce, Washington, DC (US)
Filed by NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, Gaithersburg, MD (US)
Filed on Jan. 14, 2015, as Appl. No. 14/596,355.
Claims priority of provisional application 61/928,090, filed on Jan. 16, 2014.
Prior Publication US 2015/0126031 A1, May 7, 2015
Int. Cl. H01L 21/285 (2006.01); H01L 21/306 (2006.01); C23C 18/18 (2006.01); C23C 18/16 (2006.01); C23C 18/31 (2006.01); H01Q 17/00 (2006.01); C25F 3/12 (2006.01)
CPC C23C 18/1608 (2013.01) [C23C 18/1879 (2013.01); C23C 18/31 (2013.01); C25F 3/12 (2013.01); H01L 21/28506 (2013.01); H01L 21/306 (2013.01); H01Q 17/00 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A process for depositing a metal, the process comprising:
disposing an activating catalyst on a substrate;
providing a vapor deposition composition, the vapor deposition composition separately comprising:
a plurality of metal cations; and
a plurality of reducing anions,
such that the metal cations and the reducing anions are dissociated from one another in the vapor deposition composition, and
the vapor deposition composition is provided in a gaseous state to the substrate;
contacting the activating catalyst with a metal cation from the vapor deposition composition;
contacting the substrate with a reducing anion from the vapor deposition composition;
performing an oxidation-reduction reaction between the metal cation and the reducing anion in a presence of the activating catalyst; and
forming a metal from the metal cation to deposit the metal on the substrate.