US 9,809,872 B2
Dilute copper alloy material, dilute copper alloy wire, dilute copper alloy twisted wire and cable using the same, coaxial cable and composite cable, and method of manufacturing dilute copper alloy material and dilute copper alloy wire
Seigi Aoyama, Kitaibaraki (JP); Toru Sumi, Hitachi (JP); Shuji Sakai, Tsuchiura (JP); Takahiro Sato, Hitachi (JP); and Hidenori Abe, Hitachi (JP)
Assigned to HITACHI METALS, LTD., Tokyo (JP)
Filed by Seigi Aoyama, Kitaibaraki (JP); Toru Sumi, Hitachi (JP); Shuji Sakai, Tsuchiura (JP); Takahiro Sato, Hitachi (JP); and Hidenori Abe, Hitachi (JP)
Filed on Apr. 8, 2010, as Appl. No. 12/756,551.
Claims priority of application No. 2009-101360 (JP), filed on Apr. 17, 2009; and application No. 2009-117920 (JP), filed on May 14, 2009.
Prior Publication US 2010/0263905 A1, Oct. 21, 2010
This patent is subject to a terminal disclaimer.
Int. Cl. C22C 9/00 (2006.01); B22D 11/00 (2006.01); H01B 1/02 (2006.01); C22F 1/08 (2006.01); B22D 21/02 (2006.01)
CPC C22C 9/00 (2013.01) [B22D 21/025 (2013.01); C22F 1/08 (2013.01); H01B 1/026 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A dilute copper alloy material, consisting of:
based on a total mass of the dilute copper alloy material, 3 to 12 mass ppm of sulfur, 7 to 30 mass ppm of oxygen, 4 to 40 mass ppm of titanium, and
a balance consisting of pure copper and inevitable impurity,
wherein a conductivity is not less than 102% International Annealed Copper Standard (IACS) and a softening temperature is 130° C. to 148° C., and
wherein a part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO2, TiS and Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution,
wherein the compound or the aggregate of TiO, TiO2, TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and
not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are 500 nm or less in particle size.