US 9,809,735 B2
Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same
Shusuke Yoshihara, Osaka (JP); Syoji Ubukata, Osaka (JP); and Kazuaki Matsumoto, Osaka (JP)
Assigned to Kaneka Corporation, (JP)
Appl. No. 15/101,270
Filed by Kaneka Corporation, Osaka (JP)
PCT Filed Nov. 13, 2014, PCT No. PCT/JP2014/080115
§ 371(c)(1), (2) Date Jun. 2, 2016,
PCT Pub. No. WO2015/083523, PCT Pub. Date Jun. 11, 2015.
Claims priority of application No. 2013-251286 (JP), filed on Dec. 4, 2013.
Prior Publication US 2016/0304762 A1, Oct. 20, 2016
Int. Cl. C08G 64/00 (2006.01); C09K 5/14 (2006.01); C08K 3/04 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/38 (2006.01); C08G 63/185 (2006.01); C08G 63/193 (2006.01); C08G 63/78 (2006.01); C08J 5/18 (2006.01); C08K 7/18 (2006.01); C08G 63/02 (2006.01)
CPC C09K 5/14 (2013.01) [C08G 63/185 (2013.01); C08G 63/193 (2013.01); C08G 63/78 (2013.01); C08J 5/18 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/38 (2013.01); C08K 7/18 (2013.01); C08J 2367/02 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01)] 10 Claims
 
1. A resin composition comprising:
a resin having a main chain structure including:
a unit (A) by 40 mol % to 60 mol %, the unit (A) having a biphenyl group and being represented by general formula (1):

OG Complex Work Unit Drawing
a unit (B) by 5 mol % to 40 mol %, the unit (B) being represented by general formula (2):
—CO—R1—CO—  (2)
wherein R1 represents a bivalent linear substituent (a) whose number of atoms in its main chain length is 2 to 18 and (b) which is branched or not branched; and
a unit (C) by 5 mol % to 40 mol %, the unit (C) being represented by general formula (3):
—CO—R2—CO—  (3)
wherein R2 represents a bivalent linear substituent (a) whose number of atoms in its main chain length is 4 to 20 and is larger than the number of atoms in the main chain length of R1 and (b) which is branched or not branched,
where a total amount of the units (A), (B), and (C) is 100 mol %, and a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and
an inorganic filler having thermal conductivity of not less than 1 W/(m·K).