US 9,809,728 B2
Adhesive agent composition, adhesive sheet, and electronic device and production method therefor
Kenta Nishijima, Tokyo (JP); Satoshi Naganawa, Tokyo (JP); and Emi Fuchi, Tokyo (JP)
Assigned to LINTEC CORPORATION, Tokyo (JP)
Appl. No. 14/648,579
Filed by LINTEC CORPORATION, Tokyo (JP)
PCT Filed Nov. 29, 2013, PCT No. PCT/JP2013/082173
§ 371(c)(1), (2) Date May 29, 2015,
PCT Pub. No. WO2014/084352, PCT Pub. Date Jun. 5, 2014.
Claims priority of application No. 2012-263876 (JP), filed on Nov. 30, 2012; and application No. 2012-263877 (JP), filed on Nov. 30, 2012.
Prior Publication US 2015/0299519 A1, Oct. 22, 2015
Int. Cl. C09J 7/02 (2006.01); C09J 123/22 (2006.01); H05B 33/04 (2006.01); H01L 51/52 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01)
CPC C09J 7/02 (2013.01) [B32B 37/12 (2013.01); B32B 37/182 (2013.01); C09J 7/0214 (2013.01); C09J 123/22 (2013.01); H01L 51/5246 (2013.01); H05B 33/04 (2013.01); B32B 2307/412 (2013.01); B32B 2457/206 (2013.01); C09J 2203/326 (2013.01); C09J 2205/114 (2013.01); C09J 2400/10 (2013.01); C09J 2409/00 (2013.01); C09J 2423/00 (2013.01); C09J 2467/005 (2013.01); C09J 2467/006 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/564 (2013.01); H01L 2924/0002 (2013.01)] 1 Claim
OG exemplary drawing
 
1. An adhesive composition for sealing an electronic device,
the adhesive composition consisting of an isobutylene-isoprene copolymer, a tackifier, and a solvent,
wherein the isobutylene-isoprene copolymer has a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units,
wherein the content of the tackifier is 5 to 100 parts by mass based on 100 parts by mass of the isobutylene-isoprene copolymer, and
wherein the solvent is at least one of benzene, toluene, ethyl acetate, butyl acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, n-pentane, n-hexane, n-heptane, cyclopentane or cyclohexane.