US 9,809,491 B2
Device and method for baking substrate
Shih Ying Sun, Shenzhen (CN)
Assigned to Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong (CN)
Appl. No. 14/240,331
Filed by Shenzhen China Star Optoelectronics Technology Co., Ltd, Shenzhen, Guangdong (CN)
PCT Filed Jan. 21, 2014, PCT No. PCT/CN2014/071028
§ 371(c)(1), (2) Date Feb. 21, 2014,
PCT Pub. No. WO2015/032181, PCT Pub. Date Mar. 12, 2015.
Claims priority of application No. 2013 1 0408421 (CN), filed on Sep. 9, 2013.
Prior Publication US 2015/0071622 A1, Mar. 12, 2015
Int. Cl. C03C 17/32 (2006.01); F27B 17/00 (2006.01); F27D 3/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC C03C 17/32 (2013.01) [F27B 17/0025 (2013.01); F27D 3/0084 (2013.01); H01L 21/67109 (2013.01); H01L 21/68742 (2013.01)] 7 Claims
OG exemplary drawing
1. A device for baking a substrate, including:
a hot plate, and
a supporting member for supporting a substrate to be processed,
wherein the supporting member is located between the hot plate and the substrate to be processed, and movable relative to the hot plate so as to adjust the contacting position of the supporting member with the substrate to be processed, and
wherein the supporting member includes a plurality of elongated strip bases, and on the side of each elongated strip base facing away from the hot plate there is provided with a plurality of lift pins, which are arranged at intervals and configured to support the substrate to be processed.