US 9,809,489 B2
Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
Sugirou Shimoda, Tokyo (JP); Kenzou Ookita, Tokyo (JP); Keisuke Satou, Tokyo (JP); and Kazuto Watanabe, Tokyo (JP)
Assigned to JSR Corporation, Minato-ku (JP)
Filed by JSR Corporation, Minato-ku (JP)
Filed on Sep. 10, 2015, as Appl. No. 14/849,960.
Claims priority of application No. 2014-187108 (JP), filed on Sep. 12, 2014; and application No. 2015-118320 (JP), filed on Jun. 11, 2015.
Prior Publication US 2016/0081189 A1, Mar. 17, 2016
Int. Cl. H01B 1/02 (2006.01); C03C 17/10 (2006.01); H05K 1/09 (2006.01); H05K 3/18 (2006.01); G06F 3/044 (2006.01); G06F 3/041 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01)
CPC C03C 17/10 (2013.01) [G06F 3/044 (2013.01); H01B 1/02 (2013.01); H05K 1/097 (2013.01); H05K 3/188 (2013.01); C03C 2217/253 (2013.01); C03C 2217/256 (2013.01); C03C 2217/27 (2013.01); C03C 2218/365 (2013.01); G06F 3/041 (2013.01); G06F 2203/04111 (2013.01); H05K 1/0306 (2013.01); H05K 1/0386 (2013.01); H05K 3/38 (2013.01); H05K 2203/1157 (2013.01); H05K 2203/125 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A composition for forming a conductive film, the composition comprising:
a metal salt (A1) and, optionally, a metal particle (A2) as a component (A) that serves as a metal source of the conductive film, wherein the metal particle (A2) comprise at least one metal selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au;
wherein the metal salt (A1) is a carboxylate comprising a metal selected from the group consisting of Cu, Ag, and Ni; and
a metalloxane compound (B) having at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain.