US 9,809,448 B2
Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same
Martin Lim, San Mateo, CA (US); and Fariborz Assaderaghi, Emerald Hills, CA (US)
Assigned to INVENSENSE, INC., San Jose, CA (US)
Filed by INVENSENSE, INC., San Jose, CA (US)
Filed on Feb. 10, 2015, as Appl. No. 14/618,251.
Application 14/618,251 is a continuation in part of application No. 14/174,639, filed on Feb. 6, 2014, granted, now 9,428,379.
Application 14/174,639 is a continuation of application No. 13/800,061, filed on Mar. 13, 2013, granted, now 8,692,340, issued on Apr. 8, 2014.
Prior Publication US 2015/0158722 A1, Jun. 11, 2015
Int. Cl. H01L 29/82 (2006.01); B81B 7/00 (2006.01); G01L 23/12 (2006.01); H04R 19/00 (2006.01); B81B 7/02 (2006.01)
CPC B81B 7/0061 (2013.01) [B81B 7/02 (2013.01); G01L 23/125 (2013.01); H04R 19/005 (2013.01); B81B 2201/025 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/012 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A micro electro-mechanical system (MEMS) device, comprising:
a substrate having a first surface and a second surface, wherein the first surface is exposed to an environment outside the MEMS device;
a MEMS microphone disposed at a first location on the second surface of the substrate and having a diaphragm positioned such that acoustic waves received at the MEMS microphone are incident on the diaphragm;
an integrated circuit disposed at a second location on the second surface of the substrate, wherein the integrated circuit is electrically coupled to the MEMS microphone; and
a MEMS measurement device disposed at a third location, wherein the first location and the second location are distinct locations on the second surface of the substrate, wherein the MEMS microphone is located distinct from the integrated circuit on the second surface of the substrate, and wherein the MEMS measurement device comprises a motion sensor.