US 9,809,447 B2
Pressure sensor
Yu-Hao Chien, Taipei (TW); and Li-Tien Tseng, Taoyuan County (TW)
Filed by MiraMEMS Sensing Technology Co., Ltd., Suzhou (CN)
Filed on Jan. 24, 2017, as Appl. No. 15/414,074.
Application 15/414,074 is a division of application No. 14/596,967, filed on Jan. 14, 2015, granted, now 9,598,275.
Claims priority of application No. 103121910 A (TW), filed on Jun. 25, 2014.
Prior Publication US 2017/0129774 A1, May 11, 2017
Int. Cl. B81C 1/00 (2006.01); B81B 7/02 (2006.01); B81B 7/00 (2006.01)
CPC B81B 7/0041 (2013.01) [B81C 1/00238 (2013.01); B81C 1/00293 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); B81B 2207/094 (2013.01); B81C 2201/112 (2013.01); B81C 2203/0172 (2013.01); B81C 2203/0792 (2013.01)] 14 Claims
OG exemplary drawing
1. A pressure sensor, comprising:
a first substrate comprising a metal layer, wherein the metal layer is partially exposed on a surface of the first substrate to form a first circuit, a second circuit and a conductive contact; and
a second substrate comprising a first surface and a second surface, wherein the second substrate faces the surface of the first substrate with the first surface and is electrically connected to the conductive contact, wherein the second substrate comprises:
a MEMS element corresponding to the first circuit and defining an airtight chamber with the first substrate and the second substrate;
a reference element corresponding to the second circuit and kept a fixed distance from the second circuit; and
a first airtight ring configured for surrounding the chamber, wherein the first airtight ring penetrates the second surface of the second substrate, extends to an interface between the first substrate and the second substrate, and protrudes from and breaks out the interface.