US 9,809,029 B2
Liquid ejecting apparatus and cleaning device
Shigeki Suzuki, Shiojiri (JP); Koji Harada, Shiojiri (JP); Tsuyoshi Hayashi, Shiojiri (JP); Kazuhiko Hara, Shiojiri (JP); Yasunori Koike, Matsumoto (JP); and Ryo Oguchi, Shiojiri (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Aug. 16, 2016, as Appl. No. 15/238,081.
Claims priority of application No. 2015-185755 (JP), filed on Sep. 18, 2015.
Prior Publication US 2017/0080714 A1, Mar. 23, 2017
Int. Cl. B41J 2/165 (2006.01)
CPC B41J 2/16505 (2013.01) [B41J 2/165 (2013.01); B41J 2/16544 (2013.01); B41J 2/16585 (2013.01); B41J 2002/1655 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A liquid ejecting apparatus comprising:
a liquid ejecting head which ejects liquid from a nozzle that is disposed on a nozzle surface;
an absorption member which absorbs the liquid which is adhered to the nozzle surface by contacting the nozzle surface; and
a pressing portion including a first portion and a second portion which presses the absorption member from the opposite side from the side that contacts the nozzle surface in the absorption member and causes the absorption member to contact the nozzle surface,
wherein the liquid ejecting apparatus is configured to perform a first contact operation which causes the absorption member that is pressed by the first portion of the pressing portion to contact the nozzle surface at a position which corresponds to a nozzle region that includes an opening region of the nozzle on the nozzle surface, wherein the second portion of the pressing portion does not contact the absorption member while the absorption member is contacting the nozzle region, and
a second contact operation which causes the absorption member that is pressed by the pressing portion to contact the nozzle surface at a position which corresponds to a non-nozzle region that is a region outside of the nozzle region on the nozzle surface.