US 9,809,027 B2
Method of manufacturing structure and method of manufacturing liquid ejection head
Keiji Matsumoto, Kawasaki (JP); Jun Yamamuro, Yokohama (JP); Kazuhiro Asai, Kawasaki (JP); Kunihito Uohashi, Yokohama (JP); Seiichiro Yaginuma, Kawasaki (JP); Masahisa Watanabe, Yokohama (JP); Koji Sasaki, Nagareyama (JP); Ryotaro Murakami, Yokohama (JP); and Kenji Fujii, Yokohama (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Jan. 13, 2015, as Appl. No. 14/595,937.
Claims priority of application No. 2014-005744 (JP), filed on Jan. 16, 2014.
Prior Publication US 2015/0197092 A1, Jul. 16, 2015
Int. Cl. C03C 15/00 (2006.01); C03C 25/68 (2006.01); B44C 1/22 (2006.01); G01D 15/00 (2006.01); G11B 5/127 (2006.01); B41J 2/16 (2006.01)
CPC B41J 2/1628 (2013.01) [B41J 2/1603 (2013.01); B41J 2/1631 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of manufacturing a structure comprising:
(1) positioning a first resin layer, which is made of a dry film, provided on a first supporting member on a substrate having a through hole while heating and pressurizing the first resin layer, with the first resin layer facing toward the substrate, and releasing the first supporting member from the first resin layer; and
(2) positioning a second resin layer provided on a second supporting member on the first resin layer from which the first supporting member has been released, with the second resin layer facing toward the first resin layer, and releasing the second supporting member from the second resin layer,
wherein a first resin layer portion that is above the through hole is removed simultaneously with the releasing of the first supporting member with the first resin layer portion being stuck to the first supporting member, and
wherein a thickness of the first resin layer is 8 μm or smaller.