US 9,808,966 B2
Process for making molded devices
Rene Ochrombel, Bergheim (DE)
Assigned to Novartis AG, Basel (CH)
Filed by Novartis AG, Basel (CH)
Filed on Nov. 21, 2014, as Appl. No. 14/549,636.
Claims priority of provisional application 61/910,632, filed on Dec. 2, 2013.
Prior Publication US 2015/0151461 A1, Jun. 4, 2015
Int. Cl. B29C 39/02 (2006.01); B29D 11/00 (2006.01); B29C 33/42 (2006.01); B29C 33/52 (2006.01); B29C 39/00 (2006.01); B29K 83/00 (2006.01); B29L 11/00 (2006.01); B29C 37/00 (2006.01)
CPC B29C 39/026 (2013.01) [B29C 33/424 (2013.01); B29C 33/428 (2013.01); B29C 33/52 (2013.01); B29C 39/006 (2013.01); B29D 11/00336 (2013.01); B29D 11/00519 (2013.01); B29C 2037/0035 (2013.01); B29K 2083/00 (2013.01); B29L 2011/0041 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A process for producing a device having a molded, visible symbol therein, comprising the step of:
(a) obtaining a material in liquid state, a device forming composition and a mold for cast-molding a device from the device forming composition, wherein the mold has a molding surface and a first temperature, wherein the material has a second temperature, wherein the device forming composition has a third temperature, wherein the first temperature is below the melting point of the material, wherein the second temperature is higher than the melting point of the material, wherein the third temperature is equal to or below the first temperature, wherein the material has a melting point between 15° C. and 60° C., is soluble in or can be rinsed off by at least one of water, propanol or methyl ethyl ketone at or above its melting point, and is at least temporarily resistant to the device forming composition for cast-molding the device;
(b) applying the material in liquid state onto the molding surface of the mold in the form of a symbol before using the mold for cast molding the device, wherein as the material in liquid state is cooling toward to the first temperature, the material is solidified to form the symbol as a solid elevation on the molding surface of the mold;
(c) introducing the device forming composition into the mold with the symbol as the solid elevation on the molding surface, wherein the solid elevation remains solid; and
(d) polymerizing or crosslinking the device forming composition in the mold to form the device having the molded, visible symbol as an indentation which is a reproduction of the symbol as the solid elevation on the molding surface.