US 9,808,908 B2
Method of monitoring a dressing process and polishing apparatus
Hiroyuki Shinozaki, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Aug. 27, 2013, as Appl. No. 14/11,668.
Claims priority of application No. 2012-187383 (JP), filed on Aug. 28, 2012.
Prior Publication US 2014/0065931 A1, Mar. 6, 2014
Int. Cl. B24B 49/18 (2006.01); B24B 49/16 (2006.01)
CPC B24B 49/18 (2013.01) [B24B 49/16 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of monitoring dressing of a polishing pad, said method comprising:
rotating a polishing table that supports the polishing pad;
dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad;
calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad;
monitoring dressing of the polishing pad based on the work coefficient; and
determining a remaining life of the dresser based on the work coefficient.
 
8. A polishing apparatus for polishing a substrate, comprising:
a polishing table configured to support a polishing pad;
a table motor configured to rotate the polishing table;
a dresser configured to dress the polishing pad;
a swing motor configured to cause the dresser to oscillate in a radial direction of the polishing pad;
a pressing device configured to press the dresser against the polishing pad; and
a pad monitoring device configured to monitor dressing of the polishing pad,
the pad monitoring device being configured to
calculate a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad,
monitor dressing of the polishing pad based on the work coefficient, and
determine a remaining life of the dresser based on the work coefficient.