US 9,808,903 B2
Method of polishing back surface of substrate and substrate processing apparatus
Yu Ishii, Tokyo (JP); Kenya Ito, Tokyo (JP); Masayuki Nakanishi, Tokyo (JP); and Tetsuji Togawa, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Jan. 29, 2014, as Appl. No. 14/167,934.
Claims priority of application No. 2013-018476 (JP), filed on Feb. 1, 2013.
Prior Publication US 2014/0220866 A1, Aug. 7, 2014
Int. Cl. B24B 21/06 (2006.01); B24B 37/04 (2012.01); B24B 37/30 (2012.01); B24B 7/22 (2006.01); B24B 21/00 (2006.01)
CPC B24B 7/228 (2013.01) [B24B 21/004 (2013.01); B24B 21/06 (2013.01); B24B 37/04 (2013.01); B24B 37/042 (2013.01); B24B 37/30 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A polishing method of polishing an entirety of a back surface of a substrate, comprising:
first polishing an outer circumferential region of the back surface of the substrate by placing a first polishing tool in sliding contact with the outer circumferential region of the back surface of the substrate, while holding a center-side region of the back surface of the substrate;
second polishing the center-side region of the back surface of the substrate by placing a second polishing tool in sliding contact with the center-side region of the back surface of the substrate, while holding the substrate, supporting a front side of the substrate, and rotating the second polishing tool around an axis of a rotational shaft which extends in a direction perpendicular to the back surface of the substrate; and
inverting the substrate, said inverting being performed between said first polishing and said second polishing,
wherein the first polishing tool is placed in sliding contact with only the back surface of the substrate during the first polishing.