US 9,808,890 B2
Solder alloy
Hikaru Nomura, Saitama (JP); and Shunsaku Yoshikawa, Tokyo (JP)
Assigned to Senju Metal Industry Co., Ltd., Tokyo (JP)
Appl. No. 14/394,887
Filed by Senju Metal Industry Co., Ltd., Tokyo (JP)
PCT Filed Apr. 17, 2013, PCT No. PCT/JP2013/061385
§ 371(c)(1), (2) Date Oct. 16, 2014,
PCT Pub. No. WO2013/157572, PCT Pub. Date Oct. 24, 2013.
Claims priority of application No. 2012-095000 (JP), filed on Apr. 18, 2012.
Prior Publication US 2015/0086263 A1, Mar. 26, 2015
Int. Cl. B23K 35/26 (2006.01); C22C 13/00 (2006.01); B23K 35/28 (2006.01); B23K 1/00 (2006.01); B23K 101/38 (2006.01); B23K 1/19 (2006.01); B23K 101/32 (2006.01); B23K 103/10 (2006.01); B23K 101/00 (2006.01)
CPC B23K 35/262 (2013.01) [B23K 1/00 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 35/282 (2013.01); C22C 13/00 (2013.01); B23K 2201/00 (2013.01); B23K 2201/32 (2013.01); B23K 2201/38 (2013.01); B23K 2203/10 (2013.01); Y10T 403/479 (2015.01)] 8 Claims
 
1. A solder joint made of a solder alloy having an alloy composition comprising Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass %, Ni of 0.005 through 0.3 mass % and balance of Sn,
wherein the solder joint forms a metal junction between the alloy and an Al surface or an Ni surface.