US 9,808,836 B2
Substrate processing apparatus
Tetsuji Togawa, Tokyo (JP); Kenya Ito, Tokyo (JP); Yu Ishii, Tokyo (JP); and Keisuke Uchiyama, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Jun. 26, 2014, as Appl. No. 14/316,709.
Application 14/316,709 is a division of application No. 14/315,283, filed on Jun. 25, 2014, granted, now 9,566,616.
Claims priority of application No. 2013-137541 (JP), filed on Jun. 28, 2013.
Prior Publication US 2015/0000055 A1, Jan. 1, 2015
Int. Cl. B08B 1/04 (2006.01); H01L 21/304 (2006.01); H01L 21/687 (2006.01); B24B 37/10 (2012.01); B24B 37/30 (2012.01); B08B 1/00 (2006.01); H01L 21/67 (2006.01)
CPC B08B 1/04 (2013.01) [B08B 1/001 (2013.01); B08B 1/006 (2013.01); B24B 37/10 (2013.01); B24B 37/107 (2013.01); B24B 37/30 (2013.01); H01L 21/304 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/687 (2013.01); H01L 21/68728 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate processing apparatus for processing a substrate having a first surface and a second surface, the second surface being an opposite surface of the first surface, the substrate processing apparatus comprising:
a scrubber configured to place at least one scrubbing member in sliding contact with the first surface of the substrate to process the first surface, the scrubber having a plurality of deformable elastic members supporting the at least one scrubbing member, the plurality of elastic members having top surfaces, respectively, which are spaced from each other; and
a hydrostatic support structure configured to support the second surface of the substrate via fluid without contacting the substrate.