U.S. PATENT AND TRADEMARK OFFICE
Information Products Division |
U.S. Patent Classification System - Classification Definitions
as of June 30, 2000
Patents classified in a subclass may be accessed by either clicking on
the subclass number
preceding each subclass definition or on the
" " icon, below.
( please note that patents for some subclasses may not be available )
For classification search strategies, please refer to the
Classification Index
Explanation of Data web page.
(definitions have been obtained from the
Patents ASSIST CD-ROM which
is produced by the U.S. Patent and Trademark Office
Electronic Products Branch)
Class 216
ETCHING A SUBSTRATE: PROCESSES
Class Definition:
Class 216 is an integral part of Class 156. It incorporates
all the definitions, rules, and hierarchy pertaining to
subject matter of Class 156.
GENERAL STATEMENT OF CLASS 216 SUBJECT MATTER:
This is the Generic class for chemical etching processes for
treating articles of commerce or intermediate articles not
otherwise provided for in which one of the manufacturing
steps includes a chemical etching step (use of an etchant)
and wherein the material treated is not completely removed.
(1) Note. The chemical etching required for placement in
this class is any intentional change of shape of an article
or substrate by the removal of material involving a chemical
reaction or physical solvation using a chemical agent (the
etchant). This is the residual class for removing a surface
by chemical reaction or solvent action regardless of the
substrate acted on. Bright Polishing of a metal with acid
solution is considered etching and appropriate for this
class. The processes of the patents in this class often
include the formation of a design, but the production of a
design is not required to place the patents here.
(2) Note. Reduction in size using a chemical etchant of an
unmasked article, substrate or unmasked geometric figure,
e.g., sphere, etc. is proper for this class.
(3) Note. Etching of a masked article, to direct the
etchant to only a portion of the article or substrate is
proper for this class.
(4) Note. This class is not intended for the total
dissolving of an article or substrate. Furthermore, the
remaining article or substrate must be the desired product
and not the removed material. An example of a process not
proper for Class 216 would be ore beneficiating where the
dissolved material is what is desired and useful and not the
remaining residue material. Additionally a process of
dissolving out impurities or unwanted material to leave a
desired article is proper for this class when said process is
not provided for elsewhere.
(5) Note. Chemical milling is considered within the scope
of the term etching.
(6) Note. Class 216 provides only for etching processes.
Etching compositions are elsewhere. See Lines With Other
Classes, below.
LINES WITH OTHER CLASSES AND WITHIN THIS CLASS
Class 216 is an integral part of Class 156. It incorporates
all the definitions, rules, and hierarchy pertaining to
subject matter of Class 156.
Etching compositions are in Class 252, subclasses 79.1+ (see
the class line below in regards to Class 252 and nominal
etching processes) and etching apparatus is classifiable in
Class 156, subclass 345. Compounds disclosed as useful in
etching are classified in the respective compound classes and
articles which are produced as the result of an etching
process are classified in the appropriate article class or
stock material class.
A. SPECIAL CLASS LINES
1. CLASS 29, METAL WORKING
Class 216 has several important relationships with this Class
29. Both classes take designated single-step processes, and
both are locations for multistep processes for manufacturing
designated products or using certain combinations of steps.
Single-step processes to produce a Class 29 special product,
include shaping particulate metal by pressure alone. In
addition Class 29 provides, for example, for processes of
burnishing, filing, or the mechanical joining of parts to
manufacture the special article. Where only an etching step
is claimed, the process is assigned to Class 216, even though
a product designated for Class 29 is manufactured.
Multistep processes for Class 29 are of two types: (a) Those
for making specified articles, enumerated in that part of
Class 29 schedule which precedes subclass 400.1.; (b)
Multistep manufacturing processes not provided for
elsewhere.
Insofar as processes of type (a) are concerned, these are
assigned to Class 29, even when an etching step is claimed as
part of the multistep process, except for processes
classifiable in subclasses 825+, which follows the category
(b) rule given in the next paragraph.
Processes of type (b) are provided for in Class 216 when they
claim: (1) Etching combined with the shaping of a nonmetal;
(2) Etching either nominal or specific combined with broad or
nominally claimed metal shaping steps; (3) Specific etching
including steps for assembling parts that have been etched or
are to be etched;
Processes of type (b) are classified in Class 29 when they
claim: (1) Nominal etching combined with specific metal
shaping steps; (2) Nominal etching combined with mechanical
joining, either broad or specific.
2. CLASS 438 SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS.
Classification is proper for Class 438:
(1) When the specification contains only disclosure of
semiconductive material, precursor, substrate, or device and
the claims are generic in nature the classification is proper
for Class 438.
(2). When the specification contains disclosure to species of
semiconductive material, precursor, substrate, or device and
nonsemiconductive species and the claims are directed to the
semiconductive material species only classification is proper
for Class 438.
(3) When the specification contains disclosure to species of
semiconductive material, precursor, substrate, or device only
and the claims are directed to semiconductive material
species only classification is proper for Class 438.
Classification is proper for Class 216:
(1) When the specification contains disclosure to species of
semiconductive material, precursor, substrate, or device and
nonsemiconductive species and the claims are generic in
nature the classification is proper for Class 216 Etching.
(2) When the specification contains disclosure to species of
semiconductive material, precursor, substrate, or device and
nonsemiconductive species and the claims contain
semiconductive species and nonsemiconductive species
classification is proper for Class 216 Etching.
(3) When the specification contains disclosure to
semiconductive material used in a nonelectrical function and
the claims contain semiconductive material used in
nonelectrical function classification is proper for Class 216
Etching.
B. GENERAL LINE WITH OTHER CLASSES
1. CLASS 134 CLEANING AND LIQUID CONTACT WITH SOLIDS
Class 134 is noted for cleaning processes wherein a surface
is treated to remove or separate unwanted adherent material,
e.g., dirt, scale, coatings, etc. Class 134, subclasses 1.1
through 1.3 provide for processes of cleaning using a plasma
and for cleaning of semiconductive material. Subclasses 2 and
3 are noted for chemical bleaching, oxidation, or reduction
of a metallic siliceous or calcareous base.
2. CLASS 204 CHEMISTRY: ELECTRICAL AND WAVE ENERGY and CLASS
205 ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN AND
METHODS OF PREPARING THE COMPOSITIONS
Chemical etching performed on a composition, product, or
article made by a Class 204 process (e.g., an entire article
previously etched by electrolysis, a product portion modified
by electrolytic material treatment, etc.) is considered to
provide a significant modification of the composition,
product, or article made by the Class 204 process, therefore
placing the combination of a Class 204 process followed by
Class 216 chemical etching in Class 216. However, the
combination of a Class 205 electrolytic coating step followed
by Class 216 chemical etching performed (1) to allow at least
a portion of the electrolytic coating to remain and (2) to
only significantly modify the electrolytic coating, per se,
is considered to be an electrolytic coating process followed
by a mere perfecting step for the electrolytic coating,
therefore placing the combination in Class 205. The
significant modification of only the electrolytic coating
allows for mere incidental alterations to other portions of a
coated article such as the substrate provided that such
changes are clearly unintentional (e.g., chemical etching
through an electrolytic coating which may also progress into
the substrate in some areas to allow complete penetration
through all desired other areas of the electrolytic coating,
etc.). Class 216 also provides for the original
classification when the claims are alternative (claims to a
Class 216 process and claims to a Class 205 electrolytic
etching, or when a generic claim is present and no species is
specifically claimed). When, however, a generic claim is
present (disclosure includes both Class 216 and Class 204 or
Class 205 subject matter) and a Class 204 or Class 205
species is specifically claimed, and there is no specific
claim to a Class 216 etching process, the original
classification is in Class 204 or Class 205 and a mandatory
cross-reference is placed into Class 216 based on the generic
claim.
Other combinations of Class 204 step(s) with Class 216
step(s) will follow the general class line for the
combination of Class 204 step(s) with those from other
classes as stated at the beginning of Class 204. In
particular, see Class 205, subclasses 123+, for electrolytic
coating of or with semiconductor material, subclasses 125+
for electrolytic coating to produce a circuit board or a
printed circuit, subclasses 206+ for contacting a substrate
with a solid member or material (e.g., polishing, rolling,
etc.) combined with a subsequent step of electrolytic
coating, subclasses 210+ for treating a substrate with a
liquid other than tap water (e.g., chemical etching, etc.)
combined with a subsequent step of electrolytic coating,
subclasses 640+ for electrolytic erosion of a workpiece to
change the shape or surface configuration thereof, and
subclasses 687+ for electrolytic material treatment, in
general (e.g., electrolytic stripping of an entire coated
layer from a substrate, etc.).
3. CLASS 219 ELECTRIC HEATING
See Class 219, subclasses 121.36+ for removing or altering
material by the use of a high temperature thermal plasma.
Class 216 provides for the use of a cold plasma which is a
chemical etching process involving reactive ions and a
substrate whereas the high temperature thermal plasma proper
for Class 219 alters the substrate solely by thermal means.
Class 219 subclasses 68+ provide for processes of cutting or
disintegrating metal by metal heating, subclasses 121.19+ for
processes of using an electron beam or etching or trimming
metal, subclasses 121.36+ for processes of using a high
temperature thermal plasma to etch metal, and subclasses
121.6+ for processes of using a laser to etch metal.
4. CLASS 264 PLASTIC AND NONMETALLIC ARTICLE SHAPING OR
TREATING: PROCESSES
Combinations of shaping a plastic material and etching the
shaped product, or combinations of shaping, laminating, and
etching are proper for Class 216. Laser ablation of a Class
264 material in the absence of an added reactive chemical is
proper for Class 264, however, when a reactive chemical is
used in the laser ablation process the process is
classifiable in Class 216. Subclasses 22+ for the shaping of
an article by removing a portion by electrical or wave
energy, e.g., laser ablation wherein no chemical etchant is
employed, etc., subclass 49 for forming pores in situ by
treating an occluded solid, subclasses 82+ for reactive gas
or vapor treatment of an article, subclasses 211.12+ for
processing or treating after extruding, subclasses 219+ for
processes of preparing a mold which includes an etching step
in the mold manufacture followed by a shaping operation, and
subclass 341 for the solvent polishing of a shaped or solid
article.
5. CLASS 427 COATING PROCESSES
Subclasses 307+ for processes limited to etching for making a
base more compatible with or adherent to the coating wherein
the base is the substrate (work) onto which a coating is to
applied.
6. CLASS 430 RADIATION IMAGERY CHEMISTRY: PROCESS,
COMPOSITION, OR PRODUCT THEREOF
For processes of radiation imagery including claimed exposing
and finishing by a post imaging process, e.g., developing,
etching, etc. or finishing an image, e.g., developing,
etching, etc. where the claim is silent as to an exposure
step.
Subclass 5 for producing a radiation mask, subclasses 313+
for a post imaging process of treating a resist to remove a
portion of the same.
REFERENCES TO OTHER CLASSES
SEE OR SEARCH CLASS:
8, Bleaching and Dying; Fluid Treatment and Chemical
Modification of Textiles and Fibers, appropriate subclasses
for chemical methods of dyeing fabric and the like and/or
forming an ornamental effect by the chemical modification of
a fiber or fabric.
28, Textiles: Manufacturing, is the generic class for textile
operations, especially subclasses 167+, 178+, 261, and 265+
for significantly claimed textile operations combined with
steps of coating, dyeing, fluid treatment.
51, Abrasive Tool Making Process, Material, or Composition,
subclasses 293+ for processes of making an abrading tool.
65, Glass Manufacturing, subclass 31 for etching or leaching
a glass preform, and subclass 61 for the wearing away,
abrading, or grinding of surface material.
75, Specialized Metallurgical Processes, Compositions For Use
Therein, Consolidated Metal Powder Compositions, and Loose
Particulate Mixtures, subclasses 715+ for the etching of a
metal to recover it from another metal.
101, Printing, subclass 463.1, for processes of making a
printing plate.
112, Sewing, subclass 403 for a sewn web or sheet including
a decomposable thread or component.
144, Woodworking, subclass 358 for embossing or imprinting
of wood.
148, Metal Treatment, for treating of metal to modify or
maintain the internal physical structure (microstructure) or
chemical properties of the metal. Heating and working is
most often used to effect these changes.
166, Wells, subclass 307 for methods of treating a geologic
formation in a well bore which may include an etching step.
252, Compositions, subclass 79.1 provides for patents which
in addition to an etching composition claim also contain a
claim to a nominal process of etching even though the
composition of the material treated is recited. Any detail in
the treating step, e.g., dipping, spraying, etc., is
sufficient to render the process more than nominal and proper
for Class 216. Class 216 is proper for a nominal etching
process when the etching composition is not claimed.
Subclasses 80+ for descaling agents and 89.1+, appropriate
subclasses, for detergents containing acid or alkaline agents
which may etch the substances treated and for mere methods of
use when the composition is claimed.
356, Optics: Measuring and Testing, subclass 31 for methods
of determining the orientation of the cystallos:graphic axis
of a crystal which includes etching a surface and then
optically observing the etched surface.
419, Powder Metallurgy Processes, for etching combined with a
metal powder consolidation step, subclasses 5+ for etching
or dissolving of a preformed component, e.g., core, etc. to
form a hollow metal article.
423, Chemistry of Inorganic Compounds, subclasses 1+ for
processes of treating a mixture to obtain an inorganic
compound or free elemental nonmetal which may involve a
leaching or dissolving step. Also this class generally
provides for processes involving a chemical reaction.
521, Synthetic Resins or Natural Rubbers, subclasses 61+
for forming a cellular product without expanding of the
matrix.
588, Hazardous or Toxic Waste Destruction or Containment,
appropriate subclasses for the destruction or containment of
hazardous or toxic etching waste.
GLOSSARY:
Terms used throughout the schedule and definitions are to
have the meaning ascribed below.
Generally accepted or commonly used art terms retain their
meaning found in their everyday usage and are not found in
this glossary. Certain specialized terms are employed in
these subclasses and they have been given definitions altered
to meet the needs of this class. Some or all of the terms
may be broader or more restricted as well as different in
meaning compared to normal usage.
ACID
A chemical compound which yields hydrogen ions when dissolved
in water, whose hydrogen can be replaced by metals or basic
radicals, or which reacts with bases to form salts and water
(neutralization).
GAS
Matter of very low density and viscosity, and relatively
great expansion and contraction with changes in pressure and
temperature, that is readily diffusive, with a tendency to
expand indefinitely, with molecules or atoms in free
movement. The term gas includes vapor.
GLASS
Must have all of the attributes described in 1-5 below:
(1) An inorganic product the constituents of which generally
include a glass former (e.g., As2O3, B2O3, GeO2, P2O5, SiO2,
V2O5) which has an essential characteristic of creating or
maintaining, singularly, or in a mixture that type of
structural disorder characteristic of a glassy condition,
other oxides which approach glass forming properties (e.g.,
Al2O3, BeO, PbO, Sb2O3, TiO2, ZnO, and ZrO2), as well as
oxides that are practically devoid of glass forming
tendencies (e.g. BaO, CaO, K2O, Li2O, MgO, Na2O, and SrO).
Pure and modified silica, silicon, and slag are also
included.
(2) Formed by fusion and cooled to a rigid condition
generally without crystallization.
(3) Having no definite melting point, whereby the mass has
the characteristic of passing through a plastic state before
reaching a liquid state when heated.
(4) Incapable in the solid state of permanent deformation.
(5) Fractures when subject to deformation tension.
INORGANIC
Pertaining to compounds that do not generally contain carbon
and to elements in their free form. It relates to any of the
compounds not encompassed under the term Organic defined
below in this Glossary.
METAL
As found in the Sargent - Welsh Periodic table (copyright
date 1979) of the elements, is any element not named in the
following listing, all group VIII, VIIB, VIB elements except
polonium, nitrogen, phosphorus, carbon, silicon, and boron.
ORGANIC
Is a compound containing carbon, which is further
characterized by the presence in the molecule of two carbon
atoms bonded together; or one atom of carbon bonded to at
least one atom of hydrogen or halogen; or one atom of carbon
bonded to at least one atom of nitrogen by a single or double
bond. The following compounds are specifically excluded as
being Organic for classification purposes, to-wit:
hydrocyanic acid, cyanogen, isocyanic acid, cyanamide,
cyanogen halides, isothiocyanic acid, fulminic acid, and
metal carbides.
PLASMA
A gas that is sufficiently ionized for its properties to
depend on the ionization. It contains approximately equal
numbers of positive ions and electrons, so the mixture is
electrically neutral, highly conductive, and affected by
magnetic fields. A thermal plasma is produced by
temperatures above 20,000 degrees centigrade.
RADIATION
The propagation of energy through space or through a
material. It may be in the form of electromagnetic waves,
corpuscular emissions or sound waves. The format is usually
categorized according to frequency, e.g., Hertzian, infrared,
visible light, ultraviolet, X-ray, gamma ray, etc.
Corpuscular emissions are categorized as alpha, beta, or
cosmic rays.
SUBSTRATE
The entire article or workpiece contacted by the chemical
reagent, except for materials which have been applied to an
article or workpiece for the sole expressed purpose of
protecting at least a portion thereof from the action of the
chemical material, i.e., a resist.
SUBCLASSES
Subclass:
2
ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE
HAVING A NONELECTRICAL FUNCTION:
This subclass is indented under the class definition. Process
of etching a semiconductive precursor, substrate, or device
to produce an article whose function is not related to the
conduction of electricity.
(1) Note. This subclass is directed to the manufacture of a
semiconductor containing article which has a stated function
which is nonelectrical in nature, e.g., pressure diaphragm,
spring, or coil, etc.
SEE OR SEARCH CLASS:
438, Semiconductor Device Manufacturing: Process, for (a)
combined processes and (b) unit operation not elsewhere
provided for manufacturing a semiconductive electrical
substrate or device.
Subclass:
3
FORMING OR TREATING JOSEPHSON JUNCTION ARTICLE:
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of a
superconductive material which is joined in a Josephson
Junction containing a pair of superconductive electrodes
which are separated by a thin, less conductive portion
through which superconductor tunneling may occur.
SEE OR SEARCH CLASS:
257, Active Solid-State Devices (e.g., Transistors,
Solid-State Diodes), subclasses 31+ for a Josephson
Junction device.
505, Superconductor Technology: Apparatus, Material,
Process, subclass 329 and subclasses 410+ for the use of
high temperature superconductor material in applications,
apparatus, and the materials, per se, not provided for
elsewhere.
Subclass:
4
FORMING OR TREATING A SIGN OR MATERIAL USEFUL IN A SIGN:
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of a sign
for the display of intelligence by way of symbols or for
material useful in preparing a sign.
SEE OR SEARCH THIS CLASS, SUBCLASS:
8 for forming or treating a cylindrical or tubular article
having pattern or design on its surface.
SEE OR SEARCH CLASS:
40, Card, Picture, or Sign Exhibiting, subclasses 541+ for
an illuminated sign.
Subclass:
5
Sign or material is electroluminescent:
This subclass is indented under subclass 4. Process wherein
the sign or material adiabatically emits light in an electric
field.
Subclass:
6
FORMING OR TREATING MATERIAL USEFUL IN A CAPACITOR:
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of
materials that may be used in a device composed of two
conductors separated by a dielectric capable of storing
electrical energy blocking the flow of direct current to a
degree dependent upon the capacitance and the frequency.
SEE OR SEARCH CLASS:
29, Metal Working, for making special articles as defined in
the etching class definition, note subclass 25.03 for
electrolytic device making, e.g., capacitor, etc., and
subclasses 25.41+ for electric condenser making.
174, Electricity: Conductors and Insulators, subclass 143
for bushing-type condenser.
361, Electricity: Electrical Systems and Devices, subclasses
268+ for induction apparatus combined with electrical
capacitors, subclasses 271+ for electrostatic capacitors,
subclasses 277+ for variable-type electrical capacitors, and
subclasses 500+ for electrolytic-type condensers.
Subclass:
7
FORMING OR TREATING FIBROUS ARTICLE OR FIBER REINFORCED
COMPOSITE STRUCTURE:
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of an
article or structure containing fibers.
Subclass:
8
FORMING OR TREATING CYLINDRICAL OR TUBULAR ARTICLE HAVING
PATTERN OR DESIGN ON ITS SURFACE:
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of a
cylindrical or tubular article having a pattern or design on
the article surface, e.g., pattern roll, etc.
SEE OR SEARCH CLASS:
205, Electrolysis: Processes, Compositions Used Therein, and
Methods of Preparing the Compositions, subclass 118 for
electrolytic coating of selected areas.
427, Coating Processes, subclasses 256+ for nonuniform
coating.
Subclass:
9
Forming or treating an embossing cylinder or tubular
article:
This subclass is indented under subclass 8. Process wherein
the cylinder or tubular article has a design or pattern
raised in relief above its surface and which is intended to
impress the design or pattern on other work.
Subclass:
10
Forming or treating liquid transfer cylinder or tubular
article (e.g. printing roll, etc.):
This subclass is indented under subclass 8. Process wherein
the cylinder or tubular article is intended to transfer
liquid.
SEE OR SEARCH CLASS:
101, Printing, subclasses 212+ for rolling contact printing
machines.
Subclass:
11
FORMING OR TREATING AN ARTICLE WHOSE FINAL CONFIGURATION HAS
A PROJECTION:
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of an
article whose final shape has at least one raised area above
the normal planar surface, e.g.; pointer, sound needle, etc.
SEE OR SEARCH CLASS:
438, Semiconductor Device Manufacturing: Process, subclass 20
for manufacturing an electron emissive device utilizing a
semiconductive substrate.
445, Electric Lamp or Space Discharge Component or Device
Manufacturing, subclasses 46+ for making an electrode
having a projection.
604, Surgery, subclasses 187+ for an aspirator syringe or
injector.
Subclass:
12
FORMING OR TREATING MASK USED FOR ITS NONETCHING FUNCTION
(E.G., SHADOW MASK, X-RAY MASK, ETC.):
This subclass is indented under the class definition. Process
wherein etching is used in forming or treating a mask whose
function is other than as an etch mask or etch resist, e.g.,
shadow mask, X-ray mask, etc.
SEE OR SEARCH THIS CLASS, SUBCLASS:
subclasses 41+ for the masking of a substrate using an etch
resist.
56 for making a porous or perforated article not used for
masking.
SEE OR SEARCH CLASS:
378, X-Ray or Gamma Ray Systems or Devices, subclass 35 for
mask used in a nonetching function.
430, Radiation Imagery Chemistry: Process, Composition, or
Product Thereof, subclass 5 for a radiation mask produced by
a photos:graphic step.
Subclass:
13
FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G.,
CIRCUIT, ETC.):
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of an
electrical conductor.
(1) Note. The conductor maybe either a self sustaining
conductor or a conductor on a supporting substrate, e.g., a
printed circuit, etc.
SEE OR SEARCH CLASS:
205, Electrolysis: Processes, Compositions Used Therein, and
Methods of Preparing the Compositions, subclass 125 where
the product is a circuit board or printed circuit.
427, Coating Processes, subclasses 96+ for integrated
circuit, printed circuit or circuit board making processes.
428, Stock Material or Miscellaneous Articles,
cross-reference art collection 901 for a printed circuit.
Subclass:
14
Forming or treating lead frame or beam lead:
This subclass is indented under subclass 13. Process directed
to the forming or treating of (a) a group of metal leads held
together in the proper relationship to permit connection to a
semiconductor die (integrated circuit), or (b) an
intermediate article of manufacture utilized to produce
electrical connecting structure for circuits consisting of a
generally flat electrically conductive strap or band section
which has been stamped, cut or otherwise deformed, to produce
an open encasing structure provided with a plurality of
generally rectangular cross-sectional inwardly facing bodies
designed to be attached to the circuit in a cantilever
fashion.
SEE OR SEARCH CLASS:
29, Metal Working, subclass 827 for beam lead frame or beam
lead device manufacturing including a metal working step.
Subclass:
15
Forming or treating a crossover:
This subclass is indented under subclass 13. Process directed
to the forming or treating of a circuit where one conductor
crosses over another without electrical contact due to the
presence of an insulator therebetween.
Subclass:
16
Forming or treating resistive material:
This subclass is indented under subclass 13. Process directed
to the forming or treating of material which is generally
used in a circuit containing a conductor, and which material
is intended to impede the flow of a steady or fluctuating
electrical current passing through the mass by conversion of
electrical energy to heat.
SEE OR SEARCH CLASS:
29, Metal Working, subclass 610.1 for resistor making and
subclass 621.1 for electrical strain gauge making.
252, Compositions, subclasses 500+ for an electrically
conductive or emissive composition.
257, Active Solid-State Devices (e.g., Transistors,
Solid-State Diodes) which include resistive materials in
their construction.
338, Electrical Resistors, for electrical resistor
structure.
Subclass:
17
Forming or treating of groove or through hole:
This subclass is indented under subclass 13. Process directed
to forming or treating (a) a depression of relatively small
area which is formed partially or completely through an
electrical conductor or a substrate supporting an electrical
circuit, or (b) an elongated relatively narrow trench which
is partially or completely through an electrical conductor or
substrate.
Subclass:
18
Filling or coating of groove or through hole with a conductor
to form an electrical interconnection:
This subclass is indented under subclass 17. Process directed
to filling or coating of groove or through hole with an
electrically conductive material so as to provide an
electrical interconnection in a circuit.
Subclass:
19
Filling or coating of groove or through hole in a conductor
with an insulator:
This subclass is indented under subclass 17. Process directed
to filling or coating of groove or through hole with an
insulator to thus form an insulated region in or on a
conductor.
Subclass:
20
Adhesive or autogenous bonding of self-sustaining preforms
(e.g., prefabricated base, etc.):
This subclass is indented under subclass 13. Process
including a step of adhesively or autogeneously bonding two
or more self-sustaining preforms and wherein the final
product contains the two or more adhered layers.
(1) Note. A preformed etching mask or resist is not
considered as being a preform proper for this subclass if it
ultimately to be removed. See subclasses 41+ for etching
processes involving a preformed etch mask or resist.
Subclass:
21
Repairing circuit:
This subclass is indented under subclass 13. Process directed
to the refurbishing, repairing, or recovery of a circuit as
to its electrical function.
Subclass:
22
FORMING OR TREATING ARTICLE CONTAINING MAGNETICALLY
RESPONSIVE MATERIAL:
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of an
article which contains material therein which is responsive
to magnetism.
SEE OR SEARCH CLASS:
29, Metal Working, subclasses 607+ for the making of
permanent magnets and electromagnets.
Subclass:
23
FORMING OR TREATING ARTICLE CONTAINING A LIQUID CRYSTAL
MATERIAL:
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of an
article which contains an ordered liquid, i.e., liquid
crystal.
SEE OR SEARCH CLASS:
252, Compositions, subclass 299.01 for liquid crystal
compositions.
428, Stock Material or Miscellaneous Articles, subclass 1
for liquid crystal containing stock material.
438, Semiconductor Device Manufacturing: Process, subclass 30
for manufacturing a liquid crystal display device utilizing
a semiconductive substrate having an electrical device formed
therein or thereon.
Subclass:
24
FORMING OR TREATING OPTICAL ARTICLE:
This subclass is indented under the class definition. Process
wherein etching is used in forming or treating of an article
which is either responsive to light, e.g., visible, UV, etc.
or which is intended to transmit, modify, or otherwise alter
light, e.g., visible, UV, etc.
SEE OR SEARCH CLASS:
65, Glass Manufacturing, subclasses 37+ for lens making.
264, Plastic and Nonmetallic Article Shaping or Treating:
Processes, subclass 1.1 for optical article shaping or
treating.
430, Radiation Imagery Chemistry: Process, Composition, or
Product Thereof, subclass 321 for optical device
manufacturing using an imaging technique.
Subclass:
25
Phosphor screen:
This subclass is indented under subclass 24. Process wherein
the optical article is a screen containing phosphor elements,
these elements phosphorescing (continuous emission of light)
when stimulated by an external energy source which is usually
radiation.
SEE OR SEARCH CLASS:
250, Radiant Energy, subclass 458.1 for luminophor
irradiation, and subclasses 483.1+ for luminescent device.
252, Compositions, subclass 301.16 for an organic
luminescent material containing composition, subclass 301.4
for an inorganic luminescent composition.
313, Electric Lamp and Discharge Devices, subclasses 525+
for a device containing a phosphor screen.
Subclass:
26
Lens:
This subclass is indented under subclass 24. Process wherein
the optical article contains transparent material which
converges or diverges light by refraction.
Subclass:
27
FORMING OR TREATING THERMAL INK JET ARTICLE (E.G., PRINT
HEAD, LIQUID JET RECORDING HEAD, ETC.):
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of an
article whose ultimate use is to expel an ink droplet, and in
which the ink droplet is produced by the action of thermal
energy to form a propelling vapor.
SEE OR SEARCH CLASS:
346, Recorders, subclass 1.1 for processes of using thermal
ink jet devices, subclass 75 for the use of a gas blast
against a receiver in printing.
438, Semiconductor Device Manufacturing: Process, subclass
21 for manufacturing an electrical device controlled
printhead utilizing a semiconductive substrate having an
electrical device formed therein or thereon.
Subclass:
28
FORMING OR TREATING AN ORNAMENTED ARTICLE:
This subclass is indented under the class definition. Process
wherein etching is used in the forming or treating of an
article, which article possesses an effect which is intended
to be decorative in nature, and which effect possess little
or no utilitarian function or character, and wherein the
article itself may or may not possess some form of utility.
SEE OR SEARCH CLASS:
63, Jewelry, for ornamented jewelry.
Subclass:
29
Wood surface treated or wood grain produced:
This subclass is indented under subclass 28. Process wherein
the treating is performed on the surface of a wood product to
produce a decorative wood product, or wherein a nonwood
product is treated to produce a wood grain appearance.
Subclass:
30
Treating stone (e.g., marble, etc.):
This subclass is indented under subclass 28. Process wherein
stone is treated, to produce a decorative effect thereon,
e.g., marble, etc.
Subclass:
31
Treating glass (e.g., mirror, etc.):
This subclass is indented under subclass 28. Process wherein
glass is treated to produce a decorative effect thereon,
e.g., mirror, etc.
SEE OR SEARCH THIS CLASS, SUBCLASS:
80 for etching of a silicon containing glass by a gas phase
etchant.
97 for etching of glass by nonliquid phase etchant.
99 for etching of a silicon containing substrate by a
nonliquid phase etchant.
SEE OR SEARCH CLASS:
65, Glass Manufacturing, subclass 31 for etching or leaching
of glass preform in combination with a glass manufacturing
step.
Subclass:
32
Treating elemental metal or alloy thereof:
This subclass is indented under subclass 28. Process wherein
metal or an thereof is treated to produce a decorative effect
thereon.
Subclass:
33
ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING
PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT
INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.):
This subclass is indented under the class definition. Process
s including the step of adhesively or autogenously bonding
two or more self sustaining preforms.
(1) Note. A preformed etching mask or resist is not
considered as being a preform proper for this subclass if it
is ultimately to be removed. See subclasses 41+ for etching
processes involving a preformed etch mask or resist.
(2) Note. Processes appropriate for this subclass require
the forming of intended composite materials having two or
more layers and wherein the final intended material is a
composite having two or more layers. A multilayered
substrate as a preform without the claimed forming of the
multilayers by adhesive or autogenous bonding is not
appropriate herein unless a self-sustaining preform is bonded
thereto and remains with the multilayered substrate.
Removing the self-sustaining preform (etch mask or resist)
after the etching process results in a product which does not
meet the required parameters for this subclass.
SEE OR SEARCH CLASS:
29, Metal Working, for mechanical assembly combined with
etching of special articles.
156, Adhesive Bonding and Miscellaneous Chemical Manufacture,
for adhesive bonding or laminating without etching.
Subclass:
34
Etching improves or promotes adherence of preforms being
bonded:
This subclass is indented under subclass 33. Process wherein
etching is used to improve or promote adherence or bonding
between two or more preforms.
(1) Note. Included herein is the use of etching to improve
or promote the adherence of an adhesive and a preform.
Subclass:
35
Bonding of preform of metal or an alloy thereof to a preform
of a nonmetal:
This subclass is indented under subclass 34. Process of
improving or promoting the adherence or bonding of a preform
of metal or an alloy thereof to a nonmetal preform.
Subclass:
36
Removing at least one of the self-sustaining preforms or a
portion thereof:
This subclass is indented under subclass 33. Process wherein
a delamination occurs between any two or more laminated
preforms.
(1) Note. The preform or portion delaminated may be the
same or different from the preform bonded initially. An
example of a different preform is one which has been
chemically treated after it has been united and then
removed.
Subclass:
37
ETCHING AND COATING OCCUR IN THE SAME PROCESSING CHAMBER:
This subclass is indented under the class definition. Process
wherein etching and coating occur in the same vessel.
SEE OR SEARCH CLASS:
427, Coating Processes, for etching used to perfect a coating
operation.
Subclass:
38
PLANARIZING A NONPLANAR SURFACE:
This subclass is indented under the class definition. Process
directed to the smoothing or leveling of a surface.
(1) Note. The planarizing may include the use of a
planarizing coating layer.
Subclass:
39
FORMING GROOVE OR HOLE IN A SUBSTRATE WHICH IS SUBSEQUENTLY
FILLED OR COATED:
This subclass is indented under the class definition. Process
directed to the filling or coating of a groove or hole in a
substrate after the groove or hole is formed.
Subclass:
40
FORMING PATTERN USING LIFT OFF TECHNIQUE:
This subclass is indented under the class definition. Process
directed to placing a mask on a substrate, coating, or
depositing material over the mask and substrate, then
removing the mask to remove the deposited layer on the mask,
thus leaving the deposited layer in a pattern where the mask
was not present, and etching using the pattern as a mask.
(1) Note. Any means of removal may be used to include
dissolution.
Subclass:
41
MASKING OF A SUBSTRATE USING MATERIAL RESISTANT TO AN ETCHANT
(I.E., ETCH RESIST):
This subclass is indented under the class definition. Process
directed to using a patterned material which is resistant to
the etchant.
(1) Note. This subclass rather than subclass 49 and
subclass 51 specifically provides for etch resistant material
where the disclosure of the patent is silent as to whether
the material is organic or inorganic in nature.
SEE OR SEARCH THIS CLASS, SUBCLASS:
56 for making a porous or perforated article having a
nonmasking function.
SEE OR SEARCH CLASS:
430, Radiation Imagery Chemistry: Process, Composition, or
Product Thereof, subclass 5 for a radiation mask.
Subclass:
42
Resist material applied in particulate form or spray:
This subclass is indented under subclass 41. Process wherein
the masking is applied by a coating process involving the
application of particulate material or by a spray coating
procedure.
Subclass:
43
Adhesively bonding resist to substrate:
This subclass is indented under subclass 41. Process wherein
the masking is applied by adhesively bonding a
self-sustaining patterned resist to a substrate.
SEE OR SEARCH CLASS:
156, Adhesive Bonding and Miscellaneous Chemical Manufacture,
for production of bonded materials.
Subclass:
44
Mechanically forming pattern into a resist:
This subclass is indented under subclass 41. Process directed
to the forming of a pattern into the etch resist by
mechanical means, e.g., cutting, punching, scribing using a
stylus, etc.
SEE OR SEARCH THIS CLASS, SUBCLASS:
subclasses 52+ for a separate step of mechanically shaping,
deforming, or abrading of a substrate.
Subclass:
45
Mask is reusable (i.e., stencil):
This subclass is indented under subclass 41. Process using a
prefabricated stencil or mask which may be reused in the
subsequent etching of another substrate.
Subclass:
46
Masking of sidewall:
This subclass is indented under subclass 41. Process of using
masking on a side wall of a substrate to prevent or direct
etching.
Subclass:
47
Mask is multilayer resist:
This subclass is indented under subclass 41. Process of using
an etch resist comprising plural layers.
Subclass:
48
Mask is exposed to nonimaging radiation:
This subclass is indented under subclass 41. Process of
exposing the etch resist to nonimaging radiation, e.g., U.V.
light, laser beam, etc.
SEE OR SEARCH THIS CLASS, SUBCLASS:
62 for altering of the etchability of a substrate by
irradiation, ion implantation, alloying, diffusing, or
chemically reacting the substrate during gas phase etching.
subclasses 63+ for gas phase etching with application of
energy to the substrate being etched, e.g., ultrasonic,
substrate heating, radiation, plasma, ion beam, etc.
87 for altering of the etchability of a substrate during
liquid phase etching by treatment with high energy radiation,
alloying, diffusion, or chemically reacting.
94 for liquid phase etching with high energy irradiation,
e.g., laser, e-beam, or ion beam, etc.
SEE OR SEARCH CLASS:
430, Radiation Imagery Chemistry: Process, Composition, or
Product Thereof, for the production of an image formed by use
of radiation or light combined with etching.
Subclass:
49
Mask resist contains organic compound:
This subclass is indented under subclass 41. Process wherein
the resist material contains an organic compound.
(1) Note. See Glossary for a definition of the term
Organic.
(2) Note. See subclass 41 for masking material where the
patent disclosure is silent as to its chemical nature.
Subclass:
50
Mask resist contains a color imparting agent:
This subclass is indented under subclass 49. Process wherein
the organic resist further contains a material expressly
added for imparting color to the resist.
Subclass:
51
Mask resist contains inorganic material:
This subclass is indented under subclass 41. Process wherein
the resist material is inorganic and includes material in an
elemental state.
(1) Note. See Glossary for a definition of the term
Inorganic.
SEE OR SEARCH THIS CLASS, SUBCLASS:
41 for masking material where the patent disclosure is
silent as to its chemical nature.
Subclass:
52
MECHANICALLY SHAPING, DEFORMING, OR ABRADING OF SUBSTRATE:
This subclass is indented under the class definition. Process
including a step of subjecting a substrate to physical force
of sufficient magnitude to cause permanent distortion thereof
or removal of material therefrom.
(1) Note. Included herein, e.g., are embossing, bending,
abrading, cutting, breaking, etc.
(2) Note. For the line between this class and the metal
working classes wherein a step of metal working is included,
see Lines With Other Classes And Within This Class in this
class (216).
Subclass:
53
Nongaseous phase etching:
This subclass is indented under subclass 52. Process wherein
the etchant is employed in a nongaseous phase.
(1) Note. Most of the patents herein are to the use of a
liquid etchant. See the Glossary for a definition of the term
Liquid.
Subclass:
54
PATTERN OR DESIGN APPLIED BY TRANSFER:
This subclass is indented under the class definition. Process
wherein a separately existing pattern or design is
temporarily adhered to a carrier and this pattern or design
is transferred to a substrate.
Subclass:
55
HEATING OR BAKING OF SUBSTRATE PRIOR TO ETCHING TO CHANGE THE
CHEMICAL PROPERTIES OF SUBSTRATE TOWARD THE ETCHANT:
This subclass is indented under the class definition. Process
wherein the chemical properties of a substrate toward an
etchant are altered by contacting the substrate prior to
etching with a source of heat, e.g., alloying, curing,
annealing, etc.
SEE OR SEARCH CLASS:
65, Glass Manufacturing, subclasses 117+ for annealing of
glass preform.
Subclass:
56
ETCHING TO PRODUCE POROUS OR PERFORATED ARTICLE:
This subclass is indented under the class definition. Process
wherein the action of the etchant produces relatively small
holes or channels throughout a substrate.
SEE OR SEARCH THIS CLASS, SUBCLASS:
12 for forming a mask used for a nonetching function.
SEE OR SEARCH CLASS:
106, Compositions: Coating or Plastic, subclass 122 for
pore forming.
521, Synthetic Resins or Natural Rubbers, subclasses 50+
for cellular products or processes of preparing a cellular
product.
Subclass:
57
GAS PHASE AND NONGASEOUS PHASE ETCHING ON THE SAME
SUBSTRATE:
This subclass is indented under the class definition. Process
involving etching a substrate with a plurality of etchants
and wherein at least one of the etchants is in a nongaseous
phase and at least one of the etchants is in the gas phase.
(1) Note. See the Glossary for a definition of the term
Gas.
(2) Note. Most of the patents relating to nongaseous
etching involve a liquid etchant. See the Glossary for a
definition of the term liquid.
SEE OR SEARCH THIS CLASS, SUBCLASS:
58 for gas phase etching.
83 for nongaseous phase etching
Subclass:
58
GAS PHASE ETCHING OF SUBSTRATE:
This subclass is indented under the class definition. Process
wherein the etchant is in a gaseous state when it contacts
the substrate.
(1) Note. See Glossary for a definition of the term Gas.
(2) Note. This and indented subclasses include etching
employing ionized gas with approximately equal numbers of
positive ions and electrons so the mixture is highly
conductive and affected by magnetic fields, i.e., plasma.
Subclass:
59
With measuring, testing, or inspecting:
This subclass is indented under subclass 58. Process
including the step of visually, chemically, or physically
determining or measuring a variable condition or property of
the substrate or the etching process.
(1) Note. Included here under is a process of monitoring or
controlling the etching process in response to a sensed
condition.
SEE OR SEARCH THIS CLASS, SUBCLASS:
subclasses 84+ for measuring, testing, inspecting,
monitoring or controlling of a nongaseous phase etching
process.
SEE OR SEARCH CLASS:
445, Electric Lamp or Space Discharge Component or Device
Manufacturing, subclass 3 for testing or adjusting.
Subclass:
60
By optical means or of an optical property:
This subclass is indented under subclass 59. Process where
the test is performed optically or determines an optical
property, e.g., reflectance, etc.
Subclass:
61
By electrical means or of an electrical property:
This subclass is indented under subclass 59. Process where
the test is performed electrically or determines an
electrical property, e.g. resistance, etc.
Subclass:
62
Irradiating, ion implanting, alloying, diffusing, or
chemically reacting the substrate prior to etching to change
properties of substrate toward the etchant:
This subclass is indented under subclass 58. Process wherein
a substrate is altered by contacting prior to etching with a
material or irradiation which (a) forms an alloy, (b)
diffuses into, or (c) chemically reacts with the substrate,
or causes a chemical reaction within the substrate to alter
the effect of the etchant on the substrate or any part
thereof.
SEE OR SEARCH THIS CLASS, SUBCLASS:
87 for altering of the etchability of a substrate before
nongaseous phase etching by treatment with high energy
radiation, alloying, diffusing, or chemically reacting.
SEE OR SEARCH CLASS:
438, Semiconductor Device Manufacturing: Process, subclass
705 for processes of altering the etchability of a
semiconductor substrate prior to chemical etching for
manufacturing a semiconductive electrical substrate or
device; see the search notes thereunder.
Subclass:
63
Application of energy to the gaseous etchant or to the
substrate being etched:
This subclass is indented under subclass 58. Process directed
to the application of energy to the gaseous etchant or to the
substrate being etched, e.g., Ultrasonic substrate heating,
radiation, plasma, ion beam, etc.
SEE OR SEARCH THIS CLASS, SUBCLASS:
73 for preparing etching vapor by evaporation, boiling, or
sublimation.
87 altering of the etchability of a substrate prior to
nongaseous phase etching by the use irradiation, ion
implantation, alloying, diffusing, or chemically reacting.
94 for nongaseous phase etching using high energy
irradiation, e.g., laser, e-beam, or ion beam, etc.
Subclass:
64
Etchant is devoid of chlorocarbon or fluorocarbon compound
(e.g., C.F.C., etc.):
This subclass is indented under subclass 58. Process wherein
the etchant is devoid of a compound containing at least one
chlorine and/or fluorine atom and at least one carbon atom.
(1) Note. This subclass requires that all of of the etching
materials recited be devoid of the a chlorocarbon or
flurocarbon carbon (etching mixtures). Also excluded are
multistep processes wherein one of etching steps uses a
chlorocarbon or fluorocarbon compound. See appropriate
subclasses below for etching processes using etchants
excluded from this subclass.
Subclass:
65
Using laser:
This subclass is indented under subclass 63. Process wherein
the energy source is a laser.
(1) Note. Either visible or invisible laser may be used in
this etching process.
SEE OR SEARCH CLASS:
522, Synthetic Resins or Natural Rubbers, subclass 2 for
forming or modifying a solid polymer by laser, or
compositions therefor.
Subclass:
66
Using ion beam, ultraviolet, or visible light:
This subclass is indented under subclass 63. Process wherein
the energy source is an ion beam, ultraviolet, or visible
light.
Subclass:
67
Using plasma:
This subclass is indented under subclass 63. Process wherein
the energy source is a plasma.
(1) Note. See Glossary for a definition of the term
Plasma.
Subclass:
68
Using coil to generate the plasma:
This subclass is indented under subclass 67. Process wherein
a plasma is produced by the use of a coil, e.g., external
induction coil, etc.
Subclass:
69
Using microwave to generate the plasma:
This subclass is indented under subclass 67. Process wherein
the plasma is produced by the use of microwaves.
Subclass:
70
Magnetically enhancing the plasma:
This subclass is indented under subclass 69. Process where
the plasma is intensified by the use of a magnetic field.
(1) Note. The magnetic field establishes a resonant motion
of the electrons in the chamber.
Subclass:
71
Specific configuration of electrodes to generate the plasma:
This subclass is indented under subclass 67. Process wherein
the plasma is produced using electrodes which are in a
specific enumerated configuration in relation to each other.
Subclass:
72
Etching a multiple layered substrate where the etching
condition used produces a different etching rate or
characteristic between at least two of the layers of the
substrate:
This subclass is indented under subclass 58. Process
involving the etching of a multilayered substrate, using a
single etching step, where the process parameters used causes
a difference of the etching rate or characteristic in at
least two different layers of the substrate.
Subclass:
73
Etching vapor produced by evaporation, boiling, or
sublimation:
This subclass is indented under subclass 58. Process wherein
the etching process includes the formation of the etchant
vapor by the evaporating or boiling of a liquid, or is
directly produced from a solid without the formation of a
liquid phase.
Subclass:
74
Etching inorganic substrate:
This subclass is indented under subclass 58. Process wherein
the etching step is performed on an inorganic substrate and
may include elemental material.
(1) Note. See Glossary for what is meant by the term
Inorganic.
Subclass:
75
Substrate contains elemental metal, alloy thereof, or metal
compound:
This subclass is indented under subclass 74. Process wherein
the substrate contains metal in elemental, alloy, or compound
form.
SEE OR SEARCH THIS CLASS, SUBCLASS:
subclasses 100+ for nongaseous phase etching of an
elemental metal, alloy, or metal compound containing
substrate.
Subclass:
76
Etching of substrate containing at least one compound having
at least one oxygen atom and at least one metal atom:
This subclass is indented under subclass 75. Process wherein
the material etched contains a compound having at least one
metal atom and at least one oxygen atom, e.g., indium
titanium oxide (I.T.O.), a ceramic oxide, etc.
(1) Note. The metal oxygen compound may also contain other
elements.
Subclass:
77
Etching of substrate containing elemental aluminum, or an
alloy or compound thereof:
This subclass is indented under subclass 75. Process wherein
the material to be etched contains elemental aluminum or an
alloy thereof, or a compound containing aluminum.
Subclass:
78
Etching of substrate containing elemental copper, or an alloy
or compound thereof:
This subclass is indented under subclass 75. Process wherein
the material to be etched contains elemental copper or an
alloy thereof, or a compound containing copper.
Subclass:
79
Etching silicon containing substrate:
This subclass is indented under subclass 74. Process wherein
the material to be etched contains silicon in either
elemental or combined form.
SEE OR SEARCH THIS CLASS, SUBCLASS:
subclasses 97+ for nongaseous phase etching of glass.
99 for nongaseous phase etching of a silicon containing
substrate.
SEE OR SEARCH CLASS:
438, Semiconductor Device Manufacturing: Process, for (a)
combined processes and (b) unit operation not elsewhere
provided for manufacturing a semiconductive electrical
substrate or device.
Subclass:
80
Silicon containing substrate is glass:
This subclass is indented under subclass 79. Process wherein
the material is composed of glass.
(1) Note. See Glossary for a definition of the term Glass.
SEE OR SEARCH CLASS:
65, Glass Manufacturing subclass 31 for etching or leaching
of a glass preform, made by a Class 65 glass manufacturing
method, e.g., molding, shaping, etc. of the glass in a
plastic or softened state by heating, subclass 61 for wearing
away of surface material, e.g., abrading or grinding, etc.
Subclass:
81
Etching elemental carbon containing substrate:
This subclass is indented under subclass 74. Process wherein
the material to be etched contains elemental carbon in any of
its allotropic forms, e.g., diamond, etc.
Subclass:
83
NONGASEOUS PHASE ETCHING OF SUBSTRATE:
This subclass is indented under the class definition. Process
the ... wherein the etchant used is employed in a nongaseous
phase:
(1) Note. Most of the patents found in this subclass
involve liquid phase etching processes. See Glossary for a
definition of the term Liquid.
Subclass:
84
With measuring, testing, or inspecting:
This subclass is indented under subclass 83. Process
including the step of visually, chemically, or physically
determining or measuring a variable condition or property of
the substrate or the etching process.
(1) Note. Included hereunder is a process of monitoring or
controlling the etching process in response to a sensed
condition.
SEE OR SEARCH THIS CLASS, SUBCLASS:
59 for measuring testing, inspecting, monitoring, or
controlling of gas phase etching.
93 for recycling, regenerating, or rejuvenating an etchant
including a testing, measuring, inspecting, monitoring, or
controlling step.
SEE OR SEARCH CLASS:
445, Electric Lamp or Space Discharge Component or Device
Manufacturing, subclass 3 for testing or adjusting.
Subclass:
85
By optical means or of an optical property:
This subclass is indented under subclass 84. Process where
the test is performed optically or determines an optical
property, e.g., reflectance, etc.
Subclass:
86
By electrical means or of an electrical property:
This subclass is indented under subclass 84. Process where
the test is performed electrically or determines an
electrical property, e.g., resistance, etc.
Subclass:
87
Irradiating, ion implanting, alloying, diffusing, or
chemically reacting the substrate prior to etching to change
properties of substrate toward the etchant:
This subclass is indented under subclass 83. Process wherein
a substrate is altered by contacting prior to etching with a
material or irradiation which (a) forms an alloy, (b)
diffuses into, or (c) chemically reacts with the substrate,
or causes a chemical reaction within the substrate to alter
the effect of the etchant on the substrate or any part
thereof.
SEE OR SEARCH THIS CLASS, SUBCLASS:
94 nongaseous phase etching using high energy irradiation,
e.g., laser, electron-beam, ion beam, etc., where the
substrate is not modified by irradiation prior to etching.
SEE OR SEARCH CLASS:
438, Semiconductor Device Manufacturing: Process, subclass
705 for processes of altering the etchability of a
semiconductor substrate prior the chemical etching for
manufacturing a semiconductive electrical substrate or
device; see the search notes thereunder.
Subclass:
88
Using film of etchant between a stationary surface and a
moving surface (e.g., chemical lapping, etc.):
This subclass is indented under subclass 83. Process in which
the etching occurs at the interface at a film between the
substrate and a conforming surface with relative motion
between the substrate and the conforming surface.
SEE OR SEARCH CLASS:
438, Semiconductor Device Manufacturing: Process, subclasses
691+ for chemical-mechanical polishing processes for
manufacturing a semiconductive electrical substrate or
device.
Subclass:
89
Etchant contains solid particle (e.g., abrasive for
polishing, etc.):
This subclass is indented under subclass 88. Process wherein
the etchant also contains solid particles.
Subclass:
90
Relative movement between the substrate and a confined pool
of etchant:
This subclass is indented under subclass 83. Process
including the step of causing a relative motion between a
substrate being etched and an etchant which is confined in a
container, (e.g., dipping, ultrasonic vibrating., etc.):
(1) Note. The substrate being etched may also serve as the
container.
(2) Note. Boiling a liquid etchant is not considered
sufficient for this subclass without disclosure that it is
boiled to establish relative motion.
Subclass:
91
Rotating, repeated dipping, or advancing movement of
substrate:
This subclass is indented under subclass 90. Process wherein
the substrate is (a) rotated with respect to the pool of
etchant, (b) repeatedly dipped into and removed from the same
pool of etchant, or (c) moved through a pool of etchant.
Subclass:
92
Projecting etchant against a moving substrate or controlling
the angle or pattern projection of the etchant or controlling
the angle or pattern of movement of the substrate:
This subclass is indented under subclass 83. Process wherein
an etchant is transported through space by mechanical force
and (a) brought into contact with a substrate while the
substrate is in motion, (b) the etchant or substrate is
transported at a predetermined angle, or (c) the etchant or
substrate is transported in a particular pattern.
Subclass:
93
Recycling, regenerating, or rejuvenating etchant:
This subclass is indented under subclass 83. Process which
includes the steps of reconstituing or reusing an etchant.
(1) Note. Removal of etchant from an etching bath and its
return to an etching bath is considered recycling for this
subclass.
Subclass:
94
Etching using radiation (e.g., laser, electron-beam,
ion-beam, etc.):
This subclass is indented under subclass 83. Process wherein
radiation is used separately or simultaneously during
etching.
Subclass:
95
Substrate is multilayered:
This subclass is indented under subclass 83. Process wherein
the substrate is plural layered.
(1) Note. The presence of a resist layer whose sole
function is to protect some part of the substrate from
etchant will not be considered sufficient to make the
substrate plural-layered if it is to be removed.
Subclass:
96
Etching inorganic substrate:
This subclass is indented under subclass 83. Process wherein
at least one of layers of the substrate contains inorganic
material.
(1) Note. See Glossary for a definition of the term
Inorganic.
Subclass:
97
Substrate is glass:
This subclass is indented under subclass 96. Process wherein
at least one of the layers of the substrate contains glass
material.
(1) Note. See Glossary for a definition of the term Glass.
SEE OR SEARCH CLASS:
65, Glass Manufacturing, subclass 31 for etching or leaching
of glass preform, during manufacturing of a glass preform as
per Class 65 definition.
Subclass:
98
Frosting glass:
This subclass is indented under subclass 97. Process of
producing a frost like opaque surface on the glass by
etching.
Subclass:
99
Substrate contains silicon or silicon compound:
This subclass is indented under subclass 96. Process wherein
the substrate contains silicon in either elemental form or
combined form.
SEE OR SEARCH CLASS:
438, Semiconductor Device Manufacturing: Process, for (a)
combined processes and (b) unit operation not elsewhere
provided for manufacturing a semiconductive electrical
substrate or device.
Subclass:
100
Substrate contains elemental metal, alloy thereof, or metal
compound:
This subclass is indented under subclass 96. Process wherein
the substrate contains metal in elemental, alloy, or compound
form.
Subclass:
101
Etching of a compound containing at least one oxygen atom and
at least one metal atom:
This subclass is indented under subclass 100. Process wherein
the substrate etched contains a compound having at least one
metal atom and at least one oxygen atom, e.g., indium
titanium oxide (I.T.O.), a ceramic oxide, etc.
(1) Note. The substrate may also contain other elements.
Subclass:
102
Metal is elemental aluminum, an alloy, or compound thereof:
This subclass is indented under subclass 100. Process wherein
the substrate etched contains elemental aluminum, its alloys,
or a compound thereof.
Subclass:
103
Etchant contains acid:
This subclass is indented under subclass 102. Process wherein
the substrate is etched with H+ ion producing or containing
material.
(1) Note. See Glossary for a definition of the term Acid.
Subclass:
104
Etchant contains fluoride ion:
This subclass is indented under subclass 103. Process wherein
the etchant contains fluoride ion.
Subclass:
105
Metal is elemental copper, an alloy, or compound thereof:
This subclass is indented under subclass 100. Process wherein
the substrate etched contains elemental copper, its alloys,
or a compound thereof.
Subclass:
106
Etchant contains acid:
This subclass is indented under subclass 105. Process wherein
the substrate is etched with H+ ion producing or containing
material.
(1) Note. See Glossary for a definition of the term Acid.
Subclass:
107
Etchant contains fluoride ion:
This subclass is indented under subclass 106. Process wherein
the etchant contains fluoride ion.
Subclass:
108
Etchant contains acid:
This subclass is indented under subclass 100. Process wherein
the substrate is etched with H+ ion producing or containing
material.
(1) Note. See Glossary for a definition of the term Acid.
Subclass:
109
Etchant contains fluoride ion:
This subclass is indented under subclass 108. Process wherein
the etchant contains fluoride ion.
Information Products Division -- Contacts
Questions regarding this report should be directed to:
U.S. Patent and Trademark Office
Information Products Division
PK3- Suite 441
Washington, DC 20231
tel: (703) 306-2600
FAX: (703) 306-2737
email: oeip@uspto.gov
Last Modified: 6 October 2000