| US 7,469,195 B2 | ||
| Integrated stepwise statistical process control in a plasma processing system | ||
| Chung-Ho Huang, Fremont, Calif. (US); and John A. Jensen, Alameda, Calif. (US) | ||
| Assigned to Lam Research Corporation, Fremont, Calif. (US) | ||
| Filed on Oct. 25, 2004, as Appl. No. 10/973,551. | ||
| Application 10/973551 is a division of application No. 10/165511, filed on Jun. 07, 2002, granted, now 6,825,050. | ||
| Prior Publication US 2005/0084988 A1, Apr. 21, 2005 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. G01R 27/28 (2006.01) | ||
| U.S. Cl. 702—117 | 31 Claims |
| 1. An automated process control system configured for controlling a plasma processing system having a chamber, said chamber
being configured for processing a substrate, comprising:
a first sensor disposed within said chamber, said first sensor being configured for making a first plurality of measurements
pertaining to a first parameter associated with a structure disposed at least partially within said chamber;
first logic coupled to receive said first plurality of measurements from said first sensor, said first plurality of measurements
being obtained during a testing step that is part of a manufacturing process of said plasma processing system and without
striking a plasma within said chamber, said first logic being configured for analyzing said first plurality of measurements
and for providing a first signal;
second logic coupled to receive said first signal from said first logic, said second logic being configured to stop said testing
step earlier than a scheduled termination time if said first signal indicates a fault during said testing step.
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