| US 7,468,645 B2 | ||
| Signal line circuit device | ||
| Takeshi Yamaguchi, Gunma (Japan); and Toshikazu Imaoka, Ogaki (Japan) | ||
| Assigned to Sanyo Electric Co., Ltd., Osaka (Japan) | ||
| Filed on Jan. 28, 2005, as Appl. No. 11/45,936. | ||
| Claims priority of application No. 2004-022203 (JP), filed on Jan. 29, 2004; and application No. 2004-068014 (JP), filed on Mar. 10, 2004. | ||
| Prior Publication US 2005/0168304 A1, Aug. 04, 2005 | ||
| Int. Cl. H01P 3/08 (2006.01) | ||
| U.S. Cl. 333—238 [333/246] | 4 Claims |
| 1. A signal line circuit device comprising:
a substrate;
a dielectric layer disposed over the substrate;
a signal line on one surface of the dielectric layer;
a spacer between the substrate and the dielectric layer to ensure a space between the signal line and the substrate;
a conductive member on a surface of the substrate opposite the surface of the dielectric layer on which the signal line is
disposed, the conductive member connected to a ground potential, and
a wiring layer embedded in the dielectric layer, wherein the wiring layer overlaps the signal line and is connected to the
ground potential,
wherein the signal line is disposed such that the signal line and the conductive member do not overlap each other.
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