| US 7,468,559 B2 | ||
| Semiconductor integrated circuit package having electrically disconnected solder balls for mounting | ||
| Frank L. Hall, Boise, Id. (US); and Cary J. Baerlocher, Meridian, Id. (US) | ||
| Assigned to Micron Technology, Inc., Boise, Id. (US) | ||
| Filed on Jul. 05, 2006, as Appl. No. 11/428,620. | ||
| Application 11/428620 is a division of application No. 10/123827, filed on Apr. 15, 2002, granted, now 7,276,802. | ||
| Prior Publication US 2006/0237844 A1, Oct. 26, 2006 | ||
| Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01) | ||
| U.S. Cl. 257—780 [257/734; 257/737; 257/738; 257/784; 257/787] | 23 Claims |
| 1. A board-on-chip semiconductor integrated circuit package, comprising:
a plurality of solder balls;
a printed circuit board having a slot and a plurality of substrate pads;
a die having a circuit wire connected through the slot from a circuit of the die to conductive traces disposed on the printed
circuit board and a plurality of solder balls pads arranged about the die on a circuit side thereof such that when the die
and the printed circuit board are brought into proximity with one another the plurality of solder ball pads are not disposed
adjacent to the slot, each of the plurality of solder balls being connected between one of the plurality of substrate pads
and one of the plurality of solder ball pads, each of the plurality of solder balls being electrically disconnected from the
circuit; and
an underfill material between and connecting the die and the printed circuit board, the underfill material having a coefficient
of thermal expansion that is substantially equal to the coefficient of thermal expansion of the solder ball.
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