| US 7,468,554 B2 | ||
| Heat sink board and manufacturing method thereof | ||
| Kouji Harada, Hitachinaka (Japan); Hiroatsu Tokuda, Hitachinaka (Japan); Kazuo Ojima, Hitachinaka (Japan); and Masayuki Kobayashi, Mito (Japan) | ||
| Assigned to Hitachi, Ltd., Tokyo (Japan) | ||
| Appl. No. 10/587,480 PCT Filed Mar. 11, 2005, PCT No. PCT/JP2005/004861 § 371(c)(1), (2), (4) Date Jul. 27, 2006, PCT Pub. No. WO2005/091363, PCT Pub. Date Sep. 29, 2005. |
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| Claims priority of application No. 2004-077371 (JP), filed on Mar. 18, 2004. | ||
| Prior Publication US 2007/0147005 A1, Jun. 28, 2007 | ||
| Int. Cl. H01L 23/10 (2006.01); H01L 23/34 (2006.01) | ||
| U.S. Cl. 257—706 [257/707; 257/E23.081; 257/E23.101; 257/E23.102; 257/E23.103] | 10 Claims |
| 1. A power module device, comprising:
a first heat sink having at least one hole;
at least one second heat sink being fitted in a respective one of said at least one hole and having an expansion coefficient
smaller than an expansion coefficient of said first heat sink;
a semiconductor component fixed by solder to a surface of said second heat sink; and
a plastic flow portion stress-bonded for close adhesion to an outer peripheral surface of said second heat sink, said plastic
flow portion being material of said first heat sink;
wherein a recessed-shaped pressing mark is defined by a surface of said first heat sink and an outer peripheral surface of
said second heat sink.
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