| US 7,468,550 B2 | ||
| High-performance semiconductor package | ||
| Kwon Whan Han, Seoul (Korea, Republic of) | ||
| Assigned to Hynix Semiconductor Inc., Kyoungki-do (Korea, Republic of) | ||
| Filed on Jul. 12, 2006, as Appl. No. 11/485,125. | ||
| Claims priority of application No. 10-2006-0028522 (KR), filed on May 29, 2006. | ||
| Prior Publication US 2007/0228563 A1, Oct. 04, 2007 | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—678 [257/781] | 13 Claims |
| 1. A semiconductor package comprising:
a semiconductor chip including a plurality of bonding pads;
an electrically conductive redistribution layer formed on the semiconductor chip while being connected with the bonding pads,
said electrically conductive redistribution layer being comprised of a redistribution metal layer over a seed metal layer;
a substrate attached to an upper surface of the semiconductor chip and formed with a window for exposing the redistribution
layer;
a connection member, electrically connecting the bonding pad of the semiconductor chip with the substrate;
an electrically non-conductive sealing member, substantially filling and sealing the window including the connection member
and a surface of the substrate including the semiconductor chip; and
solder balls attached to the substrate.
|