| US 7,468,327 B2 | ||
| Methods of fabricating a micromechanical structure | ||
| Chia-Hua Chang, Pingtung (Taiwan); Hua-Shu Wu, Hsinchu (Taiwan); and Tsung-Mu Lai, Hsinchu (Taiwan) | ||
| Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (Taiwan) | ||
| Filed on Jun. 13, 2006, as Appl. No. 11/451,424. | ||
| Prior Publication US 2007/0287213 A1, Dec. 13, 2007 | ||
| Int. Cl. H01L 21/31 (2006.01) | ||
| U.S. Cl. 438—758 [438/780; 257/E21.026; 257/E21.027] | 8 Claims |
| 1. A method of forming a microelectromechanical structure, comprising:
providing a substrate;
forming a first patterned sacrificial layer on portions of the substrate, the first patterned sacrificial layer comprising
a bulk portion, a protrusion portion and an opening;
forming a second patterned sacrificial layer over the first sacrificial layer, covering the protrusion portion and portions
of the bulk portion of the first patterned sacrificial layer, wherein the second patterned sacrificial layer does not cover
sidewalls and the opening of the first patterned sacrificial layer;
forming an element layer over the substrate, covering the substrate, the first patterned sacrificial layer and second patterned
sacrificial layer; and
removing the first and second patterned sacrificial layers, leaving a microstructure on the substrate.
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