| US 7,468,290 B2 | ||
| Mechanical enhancement of dense and porous organosilicate materials by UV exposure | ||
| Aaron Scott Lukas, Lansdale, Pa. (US); Mark Leonard O'Neill, Allentown, Pa. (US); Jean Louise Vincent, Bethlehem, Pa. (US); Raymond Nicholas Vrtis, Orefield, Pa. (US); Mark Daniel Bitner, Nazareth, Pa. (US); and Eugene Joseph Karwacki, Jr., Orefield, Pa. (US) | ||
| Assigned to Air Products and Chemicals, Inc., Allentown, Pa. (US) | ||
| Filed on Jul. 21, 2003, as Appl. No. 10/624,357. | ||
| Application 10/624357 is a continuation in part of application No. 10/379466, filed on Mar. 04, 2003, granted, now 7,098,149. | ||
| Prior Publication US 2004/0175501 A1, Sep. 09, 2004 | ||
| Int. Cl. H01L 51/40 (2006.01) | ||
| U.S. Cl. 438—99 [438/780; 438/795; 427/255.28; 427/569; 501/39; 501/80] | 20 Claims |
| 1. A mixture for depositing an organosilicate film comprising a dielectric constant of 3.5 or below, the mixture comprising at least one structure-former precursor selected from the group consisting of an organosilane and an organosiloxane and a pore-former precursor that is distinct from the at least one structure-former precursor, wherein the pore-former precursor is a hydrocarbon compound consisting of from 1 to 13 carbon atoms and less than or equal to 2n+2 hydrogen atoms wherein n is the number of carbon atoms, and wherein at least one of the precursors and/or the organosilicate film exhibits an absorbance in the 200 to 400 nm wavelength range. |