US 7,468,112 B2
Method of producing a ceramic laminate
Kazuhide Sato, Aichi-pref. (Japan); Hidekazu Hattori, Nagoya (Japan); Ikuo Ito, Anjyo (Japan); Syouichi Takenouchi, Toyota (Japan); and Toshiaki Kamiya, Yokkaichi (Japan)
Assigned to Denso Corporation, (Japan)
Filed on Apr. 17, 2002, as Appl. No. 10/123,206.
Claims priority of application No. 2001-119997 (JP), filed on Apr. 18, 2001; application No. 2001-133130 (JP), filed on Apr. 27, 2001; and application No. 2002-048230 (JP), filed on Feb. 25, 2002.
Prior Publication US 2002/0152857 A1, Oct. 24, 2002
Int. Cl. B32B 37/02 (2006.01); B32B 38/04 (2006.01); C04B 33/32 (2006.01); H01L 41/083 (2006.01)
U.S. Cl. 156—89.11  [156/89.12] 17 Claims
OG exemplary drawing
 
1. A method of producing a ceramic laminate by laminating a plurality of pieces of ceramic layers, said method comprising:
a temporarily press-adhering step of laminating wide ceramic sheets including a plurality of ceramic layers in the direction of width in a number of pieces smaller than a final number of the laminated layers, followed by heating and pressing in the direction of lamination to form a pre-laminate;
a unit-cutting step of forming a unit body having a width that includes a piece of ceramic layer in the direction of width and having a number of layers smaller than the final number of the laminated layers by cutting said pre-laminate into a plurality of pieces in the direction of width;
a main press-adhering step of laminating a plurality of said unit bodies so that said ceramic layers are laminated in the final number of the laminated layers, and heating and pressing said unit bodies in the direction of lamination to obtain said ceramic laminate;
a dewaxing step of heating and removing not less than 90% of a binder resin contained in said ceramic layers of said ceramic laminate after said main press-adhering step has been finished; and
a sintering step of sintering said ceramic laminate;
wherein the heating temperature in said temporarily press-adhering step is lower than the heating temperature in said main press-adhering step, and
wherein the heating temperature in said main press-adhering step is higher than the heating temperature in said temporarily press-adhering step by more than 20 degrees Celsius but is lower than the thermal decomposition temperature of said binder resin.