| US 7,467,938 B2 | ||
| Resin injecting apparatus with a cooling passage | ||
| Kenshirou Abe, Ibaraki (Japan); and Akira Suzuki, Kanagawa (Japan) | ||
| Assigned to Canon Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Oct. 03, 2007, as Appl. No. 11/866,531. | ||
| Application 11/866531 is a division of application No. 10/767720, filed on Jan. 30, 2004, granted, now 7,300,614. | ||
| Claims priority of application No. 2003-027511 (JP), filed on Feb. 04, 2003. | ||
| Prior Publication US 2008/0026227 A1, Jan. 31, 2008 | ||
| Int. Cl. B29C 45/14 (2006.01) | ||
| U.S. Cl. 425—123 [425/127; 425/129.1; 425/547; 425/548; 425/549; 425/550] | 7 Claims |
| 1. A resin injecting apparatus compnsing:
a resin injecting nozzle for injecting a molten resin into a cavity configured between a first resin molded part and a second
resin molded part connected to said first resin molded part, from a through-hole configured in said second resin molded part;
an ejection plunger for ejecting a predetermined amount of molten resin from said resin injecting nozzle;
a thermal insulating bush attached to said resin injecting nozzle;
a coolant passage which is formed in said thermal insulating bush and through which a coolant is passed; and
coolant supplying means for supplying the coolant to the coolant passage,
wherein a bottom surface of said thermal insulating bush abuts on an end surface of said second resin molded part.
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