| US 7,467,552 B2 | ||
| Miniature package for translation of sensor sense axis | ||
| Douglas C. MacGugan, Bellevue, Wash. (US) | ||
| Assigned to Honeywell International Inc., Morristown, N.J. (US) | ||
| Filed on Nov. 10, 2005, as Appl. No. 11/272,154. | ||
| Prior Publication US 2007/0101812 A1, May 10, 2007 | ||
| Int. Cl. G01P 1/02 (2006.01) | ||
| U.S. Cl. 73—493 | 12 Claims |
| 1. An apparatus for orthogonally translating an input axis of a Micro Electro-Mechanical System (MEMS) sensor, the apparatus
comprising:
a bracket having a bracket body and a bracket leg extending therefrom, the bracket body and bracket leg forming respective
first and second substantially planar and mutually orthogonal surfaces;
the first orthogonal surfaces formed by the bracket body further comprises a MEMS sensor die attach surface plane structured
for attaching a MEMS sensor die;
the second orthogonal surface formed by the bracket leg further comprises a plurality of electrical interface contacts structured
for interfacing with a host structure that is to be monitored; and
a plurality of electrical signal carriers communicating between a portion of the bracket body adjacent to the MEMS sensor
mounting surface and the plurality of electrical interface contacts positioned on the interfacing surface of the bracket leg,
wherein the bracket leg forms one of an offset T-shape and an L-shape with the bracket body.
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