US 7,467,546 B2
Equipment for measuring gas flow rate
Shinya Igarashi, Ibaraki-ken (Japan); Hiroshi Kikawa, Ibaraki-ken (Japan); Yasuhiro Asano, Ibaraki-ken (Japan); and Naoki Saito, Ibaraki-ken (Japan)
Assigned to Hitachi, Ltd., Tokyo (Japan); and Hitachi Car Engineering Co., Ltd., Hitachinaka-shi (Japan)
Filed on Jan. 23, 2006, as Appl. No. 11/336,936.
Application 11/336936 is a division of application No. 10/484075, filed on Jan. 16, 2004, granted, now 7,004,022.
Prior Publication US 2006/0156808 A1, Jul. 20, 2006
This patent is subject to a terminal disclaimer.
Int. Cl. G01F 1/68 (2006.01)
U.S. Cl. 73—204.22  [73/202.5] 5 Claims
OG exemplary drawing
 
2. A gas flow measurement apparatus, comprising:
a sub-passage for making part of a gas flow which flows in a main passage for making the gas flow; and
gas flow detecting elements which are provided at said sub-passage for detecting a gas flow rate;
wherein
a through hole between the internal surface and the external surface of said sub-passage is provided en route from the inlet of the said sub-passage to the outlet thereof;
a deflecting structure for changing the direction of the gas flow in the sub-passage is provided upstream of said through hole on the internal surface; and
the opening of said through hole on the internal surface of said sub-passage is formed as a separation flow area for separating the gas flow from the said internal surface by said deflecting structure.