dynamically during runtime determining a thermal influence a second component has on a first component is greater than a thermal influence a third component has on the first component; and

dynamically during runtime managing a thermal condition of the first component based on the determination by adjusting a thermal condition of the second component in the thermal zone to reduce a temperature of the second component instead of adjusting a thermal condition of the third component to reduce the temperature of the third component, wherein at least one of the first component, the second component, and the third component is a processor.