| US 7,465,764 B2 | ||
| Epoxy sizing composition for filament winding | ||
| Leonard J. Adzima, Pickerington, Ohio (US); William G. Hager, Westerville, Ohio (US); Kevin Guigley, Granville, Ohio (US); David D. Hokens, Pataskala, Ohio (US); Jeff L. Antle, Canyon, Tex. (US); John R. Green, Alexandria, Ohio (US); and Teresa Wagner, Granville, Ohio (US) | ||
| Assigned to OCV Intellectual Captial, LLC, , Del. (US) | ||
| Filed on Jun. 18, 2004, as Appl. No. 10/872,103. | ||
| Prior Publication US 2005/0279140 A1, Dec. 22, 2005 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. C08G 67/02 (2006.01) | ||
| U.S. Cl. 524—612 [106/287.22] | 28 Claims |
| 1. An aqueous sizing composition comprising:
an epoxy resin emulsion containing an epoxy resin having an epoxy equivalent weight from 175-190 and at least one surfactant;
one or more organosilane coupling agents containing the structure Si(OR)2, where R is an organic group;
a cationic lubricant;
boric acid; and
at least one weak acid.
|