| US 7,465,655 B2 | ||
| Integrated circuit with substantially perpendicular wire bonds | ||
| John M. Brennan, Wyomissing, Pa. (US); Donald Farrell, Allentown, Pa. (US); and Joseph Michael Freund, Fogelsville, Pa. (US) | ||
| Assigned to Agere Systems Inc., Allentown, Pa. (US) | ||
| Filed on Jul. 27, 2006, as Appl. No. 11/494,221. | ||
| Application 11/494221 is a division of application No. 10/926631, filed on Aug. 26, 2004, granted, now 7,109,589, filed on Sep. 19, 2006. | ||
| Prior Publication US 2006/0264024 A1, Nov. 23, 2006 | ||
| Int. Cl. H01L 21/44 (2006.01); B23K 37/00 (2006.01) | ||
| U.S. Cl. 438—617 [257/E21.506; 228/4.5] | 14 Claims |
| 1. A method for performing a wire-bonding operation in an integrated circuit, utilizing a bonding tool, the method comprising
the steps of:
bonding a wire to a first bond site in the integrated circuit; and
terminating the wire at a second bond site;
wherein the bonding and terminating steps are repeated for a plurality of additional wires to form a first subset of bonded
wires connecting a first circuit element of a plurality of circuit elements to a second circuit element of the plurality of
circuit elements, and a second subset of bonded wires connecting the first circuit element to a lead of the integrated circuit
package, wherein the second element is disposed at least partially between the first element and the lead of the integrated
circuit package, and at least one bonded wire in the first subset of bonded wires and at least one bonded wire in the second
subset of bonded wires are substantially perpendicular to one another at a crossing point of the bonded wires in a plan view
of the integrated circuit.
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