| US 7,465,419 B1 | ||
| Method for providing a compliant cantilevered micromold | ||
| Alfredo M. Morales, Livermore, Calif. (US); Linda A. Domeier, Danville, Calif. (US); Marcela G. Gonzales, Shoreline, Wash. (US); Patrick N. Keifer, Livermore, Calif. (US); and Terry J. Garino, Albuquerque, N. Mex. (US) | ||
| Assigned to Sandia Corporation, Livermore, Calif. (US) | ||
| Filed on May 24, 2006, as Appl. No. 11/440,867. | ||
| Application 11/440867 is a division of application No. 10/222763, filed on Aug. 15, 2002, granted, now 7,090,189. | ||
| Application 10/222763 is a continuation in part of application No. 10/052948, filed on Jan. 17, 2002, granted, now 6,679,471, filed on Jan. 20, 2004. | ||
| Application 10/052948 is a continuation in part of application No. 09/765078, filed on Jan. 17, 2001, granted, now 6,422,528, filed on Jul. 23, 2002. | ||
| Int. Cl. B29C 33/00 (2006.01) | ||
| U.S. Cl. 264—219 [264/279; 264/279.1] | 7 Claims |
| 1. A method for fabricating a compliant cantilevered micromold having an electroplatable backing comprised of a porous metal
material, the method comprising the steps of:
a) infusing a compliant polymeric material through a porous metal material into a tooled master part having cantilevered features
therein so as to conform the compliant polymeric material to the cantilevered features;
b) hardening or polymerizing the infused compliant polymeric material; and
c) separating the tooled master part from the porous metal substrate and the hardened or polymerized compliant polymeric material
to provide a compliant cantilevered micromold having an electrically conducting backing.
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